KR940012588A - 아이씨 (ic) 리이드의 굴곡 교정장치 - Google Patents
아이씨 (ic) 리이드의 굴곡 교정장치 Download PDFInfo
- Publication number
- KR940012588A KR940012588A KR1019930023368A KR930023368A KR940012588A KR 940012588 A KR940012588 A KR 940012588A KR 1019930023368 A KR1019930023368 A KR 1019930023368A KR 930023368 A KR930023368 A KR 930023368A KR 940012588 A KR940012588 A KR 940012588A
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- curvature
- correction device
- mold
- contact
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
IC 리이드에 큰 상처를 주는 일이 없어 정확히 IC 리이드의 굴곡을 교정할 수 있는 굴곡 교정장치를 제공함을 목적으로 IC 리이드의 가로 방향으로의 굴곡을 교정하기 위한 교정장치에 있어서, IC리이드(101) 사이에 삽입되는 빗칼형상의 갈퀴(103)를 지닌 금형(100)을 설치하여 이 금형(100)의 갈퀴(103)에 IC 리이드(101)의 선단부(101b)에만 접촉하여 그 선단부(101b)를 전개하기 위한 접촉부분(103b)을 설치한 것을 특징으로 한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 IC 리이드의 굴곡 교정장치의 한 실시예를 나타낸 정면도.
Claims (1)
- IC 리이드의 가로방향으로의 굴곡을 교정하기 위한 교정장치에 있어서, IC 리이드 사이에 삽입되는 빗칼 형상의 갈퀴를 지닌 금형을 설치하여 이 금형의 갈퀴에 IC 리이드의 선단부에만 접촉하여 그 선단부를 전개하기 위한 접촉부분을 설치한 것을 특징으로 하는 IC 리이드의 굴곡 교정장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP92-331141 | 1992-11-17 | ||
JP4331141A JPH06163782A (ja) | 1992-11-17 | 1992-11-17 | Icリードの曲り矯正装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940012588A true KR940012588A (ko) | 1994-06-23 |
KR0128173B1 KR0128173B1 (ko) | 1998-04-02 |
Family
ID=18240334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930023368A KR0128173B1 (ko) | 1992-11-17 | 1993-11-05 | 아이씨(ic) 리이드의 구부러짐 교정장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5477894A (ko) |
JP (1) | JPH06163782A (ko) |
KR (1) | KR0128173B1 (ko) |
GB (1) | GB2272392A (ko) |
MY (1) | MY108938A (ko) |
PH (1) | PH31517A (ko) |
TW (1) | TW231365B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982868A (ja) * | 1995-09-19 | 1997-03-28 | Mitsubishi Electric Corp | 半導体装置の外部リード修正機及びこれを備えた半導体装置の外観検査装置 |
JP2834092B2 (ja) * | 1996-08-16 | 1998-12-09 | 九州日本電気株式会社 | Icの外部リード成形装置および成形方法 |
US5826630A (en) * | 1996-09-30 | 1998-10-27 | Semiconductor Technologies & Instruments, Inc. | J-lead conditioning method and apparatus |
US6014993A (en) * | 1998-03-27 | 2000-01-18 | Mcms, Inc. | Method and apparatus for configuring component leads |
EP2025274B1 (en) | 2007-08-13 | 2012-07-11 | Gotohti.Com Inc. | Touchless optically controlled dispenser |
CN102921783B (zh) * | 2012-10-29 | 2016-01-20 | 昆山市力格自动化设备有限公司 | 折弯机物料梭直装置 |
CN112705809B (zh) * | 2020-12-31 | 2024-03-15 | 合肥圣达电子科技实业有限公司 | 一种针栅式红外探测器外壳的装架方法及装架模具 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3687172A (en) * | 1970-10-07 | 1972-08-29 | Signetics Corp | Lead straightener and method |
JPS58154253A (ja) * | 1982-03-09 | 1983-09-13 | Hitachi Ltd | Icリ−ド矯正機構 |
JPS59201450A (ja) * | 1983-04-28 | 1984-11-15 | Toshiba Corp | 電子部品のリ−ド矯正装置 |
US4643234A (en) * | 1985-09-13 | 1987-02-17 | Alpha Modular Systems | Apparatus to straighten the leads of a pin grid array |
-
1992
- 1992-11-17 JP JP4331141A patent/JPH06163782A/ja active Pending
-
1993
- 1993-11-03 TW TW082109181A patent/TW231365B/zh active
- 1993-11-05 GB GB9322987A patent/GB2272392A/en not_active Withdrawn
- 1993-11-05 KR KR1019930023368A patent/KR0128173B1/ko not_active IP Right Cessation
- 1993-11-10 MY MYPI93002354A patent/MY108938A/en unknown
- 1993-11-15 US US08/151,811 patent/US5477894A/en not_active Expired - Fee Related
- 1993-11-16 PH PH47272A patent/PH31517A/en unknown
Also Published As
Publication number | Publication date |
---|---|
GB9322987D0 (en) | 1994-01-05 |
US5477894A (en) | 1995-12-26 |
TW231365B (ko) | 1994-10-01 |
JPH06163782A (ja) | 1994-06-10 |
GB2272392A (en) | 1994-05-18 |
PH31517A (en) | 1998-11-03 |
MY108938A (en) | 1996-11-30 |
KR0128173B1 (ko) | 1998-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |