JPH06120321A - 基板ハンドリング装置 - Google Patents

基板ハンドリング装置

Info

Publication number
JPH06120321A
JPH06120321A JP26717192A JP26717192A JPH06120321A JP H06120321 A JPH06120321 A JP H06120321A JP 26717192 A JP26717192 A JP 26717192A JP 26717192 A JP26717192 A JP 26717192A JP H06120321 A JPH06120321 A JP H06120321A
Authority
JP
Japan
Prior art keywords
wafer
substrate
semiconductor wafer
semiconductor
pusher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26717192A
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Ishimori
貴 石杜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Tokyo Electron Tohoku Ltd
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Tohoku Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Tohoku Ltd filed Critical Tokyo Electron Ltd
Priority to JP26717192A priority Critical patent/JPH06120321A/ja
Priority to TW082107959A priority patent/TW239232B/zh
Priority to US08/130,441 priority patent/US5383783A/en
Priority to KR1019930020597A priority patent/KR940010264A/ko
Publication of JPH06120321A publication Critical patent/JPH06120321A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP26717192A 1992-10-06 1992-10-06 基板ハンドリング装置 Pending JPH06120321A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP26717192A JPH06120321A (ja) 1992-10-06 1992-10-06 基板ハンドリング装置
TW082107959A TW239232B (enExample) 1992-10-06 1993-09-27
US08/130,441 US5383783A (en) 1992-10-06 1993-10-01 Substrate handling apparatus
KR1019930020597A KR940010264A (ko) 1992-10-06 1993-10-06 기판 핸들링 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26717192A JPH06120321A (ja) 1992-10-06 1992-10-06 基板ハンドリング装置

Publications (1)

Publication Number Publication Date
JPH06120321A true JPH06120321A (ja) 1994-04-28

Family

ID=17441095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26717192A Pending JPH06120321A (ja) 1992-10-06 1992-10-06 基板ハンドリング装置

Country Status (4)

Country Link
US (1) US5383783A (enExample)
JP (1) JPH06120321A (enExample)
KR (1) KR940010264A (enExample)
TW (1) TW239232B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6528808B1 (en) 1997-03-19 2003-03-04 Omron Corporation Transmitting photoelectric sensor array
DE10057079C2 (de) * 1999-11-19 2003-04-24 Advantest Corp Korpuskularstrahl-Belichtungsvorrichtung

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335622A (ja) * 1995-06-07 1996-12-17 Tokyo Electron Ltd 基板搬送装置
US5609376A (en) * 1995-09-08 1997-03-11 Micron Technology, Inc. Wafer carrier handle assembly
US5695331A (en) * 1996-01-18 1997-12-09 Btu International Multiple width boat carrier for vertical ovens
KR100332577B1 (ko) * 1999-04-21 2002-04-17 김창덕 김 구이기
JP3464177B2 (ja) * 1999-09-06 2003-11-05 沖電気工業株式会社 半導体製造装置および静電気除去方法
KR20000024122A (ko) * 2000-01-24 2000-05-06 송경수 구이 김에 디 에이치 에이를 함유시키는 방법 및 장치
KR20010110977A (ko) * 2001-01-19 2001-12-15 주식회사 소윤식품 기능성 조미김의 제조방법
KR100481307B1 (ko) * 2001-11-08 2005-04-07 삼성전자주식회사 반도체 제조 설비의 카세트 테이블
KR100651239B1 (ko) * 2005-06-20 2006-11-30 김병철 김 구이기
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket
CN204937899U (zh) * 2015-09-10 2016-01-06 合肥京东方光电科技有限公司 一种基板卡匣
CN114496867B (zh) * 2020-10-26 2025-10-28 上海果纳半导体技术有限公司 一种晶圆传输系统及半导体设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
KR0139026B1 (ko) * 1988-02-05 1998-06-01 후세 노보루 보우트 반송방법 및 열처리 장치
JP3006714B2 (ja) * 1988-12-02 2000-02-07 東京エレクトロン株式会社 縦型基板移載装置及び縦型熱処理装置並びに縦型熱処理装置における基板移載方法
JPH04186862A (ja) * 1990-11-21 1992-07-03 Tokyo Electron Sagami Ltd キャリア内基板の検出装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6528808B1 (en) 1997-03-19 2003-03-04 Omron Corporation Transmitting photoelectric sensor array
DE10057079C2 (de) * 1999-11-19 2003-04-24 Advantest Corp Korpuskularstrahl-Belichtungsvorrichtung

Also Published As

Publication number Publication date
KR940010264A (ko) 1994-05-24
US5383783A (en) 1995-01-24
TW239232B (enExample) 1995-01-21

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20020604