JPH059509B2 - - Google Patents
Info
- Publication number
- JPH059509B2 JPH059509B2 JP58012687A JP1268783A JPH059509B2 JP H059509 B2 JPH059509 B2 JP H059509B2 JP 58012687 A JP58012687 A JP 58012687A JP 1268783 A JP1268783 A JP 1268783A JP H059509 B2 JPH059509 B2 JP H059509B2
- Authority
- JP
- Japan
- Prior art keywords
- less
- punching
- lead frame
- frame material
- workability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/456—Materials
Landscapes
- Heat Treatment Of Steel (AREA)
- Heat Treatment Of Sheet Steel (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58012687A JPS59139655A (ja) | 1983-01-31 | 1983-01-31 | 打ち抜き加工性に優れたリードフレーム材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58012687A JPS59139655A (ja) | 1983-01-31 | 1983-01-31 | 打ち抜き加工性に優れたリードフレーム材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59139655A JPS59139655A (ja) | 1984-08-10 |
| JPH059509B2 true JPH059509B2 (enExample) | 1993-02-05 |
Family
ID=11812283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58012687A Granted JPS59139655A (ja) | 1983-01-31 | 1983-01-31 | 打ち抜き加工性に優れたリードフレーム材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59139655A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0762208B2 (ja) * | 1989-07-10 | 1995-07-05 | 住友金属工業株式会社 | 打抜き加工性にすぐれた鋼板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757548B2 (enExample) * | 1973-12-27 | 1982-12-04 | Daido Steel Co Ltd | |
| JPS5172916A (enExample) * | 1974-12-23 | 1976-06-24 | Daido Steel Co Ltd |
-
1983
- 1983-01-31 JP JP58012687A patent/JPS59139655A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59139655A (ja) | 1984-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4676827A (en) | Wire for bonding a semiconductor device and process for producing the same | |
| CN101113499A (zh) | 具有高强度和高抗软化性的铜合金 | |
| US6506269B2 (en) | High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same | |
| KR100562790B1 (ko) | 동합금 및 동합금박판 | |
| JP4439447B2 (ja) | 異形断面銅合金板の製造方法 | |
| JP2962139B2 (ja) | メッキ性および導電性に優れた銅合金およびこの銅合金からなる薄板または条 | |
| JP4043118B2 (ja) | 耐熱性に優れる電気・電子部品用高強度・高導電性Cu−Fe系合金板 | |
| JP2002194461A (ja) | リードフレーム用銅合金及びその製造方法 | |
| JPH11343527A (ja) | プレス打ち抜き加工時の熱処理性に優れる高強度、高導電性銅合金 | |
| JPS628501B2 (enExample) | ||
| JPH10324935A (ja) | リードフレーム用銅合金およびその製造方法 | |
| JPS59100215A (ja) | リ−ドフレ−ム材料の製造方法 | |
| JPH0978162A (ja) | 電子機器用銅合金およびその製造方法 | |
| US20030155050A1 (en) | High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes | |
| JPH01198440A (ja) | 高力電気電子機器用銅合金 | |
| JPS59139655A (ja) | 打ち抜き加工性に優れたリードフレーム材料 | |
| JPH034612B2 (enExample) | ||
| JP3379153B2 (ja) | リードフレーム用Fe−Ni合金及びリードフレーム用帯板 | |
| JP2662209B2 (ja) | メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法 | |
| JPH11323464A (ja) | 耐打抜き金型摩耗性に優れた銅合金および銅合金薄板 | |
| JP3000154B2 (ja) | リードフレーム材の製造方法 | |
| JPH11243171A (ja) | リードフレーム用銅合金 | |
| JP2568063B2 (ja) | 電気電子部品用銅合金 | |
| JP2012153950A (ja) | 銅合金板およびその製造方法 | |
| JPS58147140A (ja) | 半導体装置のリ−ド材 |