JPH059509B2 - - Google Patents

Info

Publication number
JPH059509B2
JPH059509B2 JP58012687A JP1268783A JPH059509B2 JP H059509 B2 JPH059509 B2 JP H059509B2 JP 58012687 A JP58012687 A JP 58012687A JP 1268783 A JP1268783 A JP 1268783A JP H059509 B2 JPH059509 B2 JP H059509B2
Authority
JP
Japan
Prior art keywords
less
punching
lead frame
frame material
workability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58012687A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59139655A (ja
Inventor
Shozo Abeyama
Norihiko Yamada
Shinichiro Yahagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP58012687A priority Critical patent/JPS59139655A/ja
Publication of JPS59139655A publication Critical patent/JPS59139655A/ja
Publication of JPH059509B2 publication Critical patent/JPH059509B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/456Materials

Landscapes

  • Heat Treatment Of Steel (AREA)
  • Heat Treatment Of Sheet Steel (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58012687A 1983-01-31 1983-01-31 打ち抜き加工性に優れたリードフレーム材料 Granted JPS59139655A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58012687A JPS59139655A (ja) 1983-01-31 1983-01-31 打ち抜き加工性に優れたリードフレーム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58012687A JPS59139655A (ja) 1983-01-31 1983-01-31 打ち抜き加工性に優れたリードフレーム材料

Publications (2)

Publication Number Publication Date
JPS59139655A JPS59139655A (ja) 1984-08-10
JPH059509B2 true JPH059509B2 (enExample) 1993-02-05

Family

ID=11812283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58012687A Granted JPS59139655A (ja) 1983-01-31 1983-01-31 打ち抜き加工性に優れたリードフレーム材料

Country Status (1)

Country Link
JP (1) JPS59139655A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0762208B2 (ja) * 1989-07-10 1995-07-05 住友金属工業株式会社 打抜き加工性にすぐれた鋼板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5757548B2 (enExample) * 1973-12-27 1982-12-04 Daido Steel Co Ltd
JPS5172916A (enExample) * 1974-12-23 1976-06-24 Daido Steel Co Ltd

Also Published As

Publication number Publication date
JPS59139655A (ja) 1984-08-10

Similar Documents

Publication Publication Date Title
US4676827A (en) Wire for bonding a semiconductor device and process for producing the same
CN101113499A (zh) 具有高强度和高抗软化性的铜合金
US6506269B2 (en) High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same
KR100562790B1 (ko) 동합금 및 동합금박판
JP4439447B2 (ja) 異形断面銅合金板の製造方法
JP2962139B2 (ja) メッキ性および導電性に優れた銅合金およびこの銅合金からなる薄板または条
JP4043118B2 (ja) 耐熱性に優れる電気・電子部品用高強度・高導電性Cu−Fe系合金板
JP2002194461A (ja) リードフレーム用銅合金及びその製造方法
JPH11343527A (ja) プレス打ち抜き加工時の熱処理性に優れる高強度、高導電性銅合金
JPS628501B2 (enExample)
JPH10324935A (ja) リードフレーム用銅合金およびその製造方法
JPS59100215A (ja) リ−ドフレ−ム材料の製造方法
JPH0978162A (ja) 電子機器用銅合金およびその製造方法
US20030155050A1 (en) High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes
JPH01198440A (ja) 高力電気電子機器用銅合金
JPS59139655A (ja) 打ち抜き加工性に優れたリードフレーム材料
JPH034612B2 (enExample)
JP3379153B2 (ja) リードフレーム用Fe−Ni合金及びリードフレーム用帯板
JP2662209B2 (ja) メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JPH11323464A (ja) 耐打抜き金型摩耗性に優れた銅合金および銅合金薄板
JP3000154B2 (ja) リードフレーム材の製造方法
JPH11243171A (ja) リードフレーム用銅合金
JP2568063B2 (ja) 電気電子部品用銅合金
JP2012153950A (ja) 銅合金板およびその製造方法
JPS58147140A (ja) 半導体装置のリ−ド材