JPH0587377B2 - - Google Patents

Info

Publication number
JPH0587377B2
JPH0587377B2 JP60182636A JP18263685A JPH0587377B2 JP H0587377 B2 JPH0587377 B2 JP H0587377B2 JP 60182636 A JP60182636 A JP 60182636A JP 18263685 A JP18263685 A JP 18263685A JP H0587377 B2 JPH0587377 B2 JP H0587377B2
Authority
JP
Japan
Prior art keywords
polyimide film
heating
film
less
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60182636A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6241024A (ja
Inventor
Mitsuo Sono
Tetsuo Yoshioka
Kosaku Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP18263685A priority Critical patent/JPS6241024A/ja
Publication of JPS6241024A publication Critical patent/JPS6241024A/ja
Publication of JPH0587377B2 publication Critical patent/JPH0587377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP18263685A 1985-08-19 1985-08-19 加熱収縮性の改良されたポリイミドフイルム Granted JPS6241024A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18263685A JPS6241024A (ja) 1985-08-19 1985-08-19 加熱収縮性の改良されたポリイミドフイルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18263685A JPS6241024A (ja) 1985-08-19 1985-08-19 加熱収縮性の改良されたポリイミドフイルム

Publications (2)

Publication Number Publication Date
JPS6241024A JPS6241024A (ja) 1987-02-23
JPH0587377B2 true JPH0587377B2 (enrdf_load_stackoverflow) 1993-12-16

Family

ID=16121755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18263685A Granted JPS6241024A (ja) 1985-08-19 1985-08-19 加熱収縮性の改良されたポリイミドフイルム

Country Status (1)

Country Link
JP (1) JPS6241024A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10259177B2 (en) 2013-03-29 2019-04-16 Ube Industries, Ltd. Film manufacturing method and manufacturing apparatus

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3020176B2 (ja) * 1989-07-25 2000-03-15 東レ・デュポン株式会社 低収縮性ポリイミドフィルム
JP3020174B2 (ja) * 1989-07-25 2000-03-15 東レ・デュポン株式会社 低収縮性ポリイミドフィルム
JP3020175B2 (ja) * 1989-07-25 2000-03-15 東レ・デュポン株式会社 低収縮性ポリイミドフィルム
JP2001164006A (ja) * 1999-12-09 2001-06-19 Du Pont Toray Co Ltd ポリイミドフィルム
TW588345B (en) * 2001-09-28 2004-05-21 Sony Corp Optical recording medium and its manufacturing method
KR101195719B1 (ko) * 2004-01-13 2012-10-29 가부시키가이샤 가네카 접착 필름 및 이것으로부터 얻어지는 치수 안정성을 향상시킨 연성 금속장 적층판, 및 그의 제조 방법
WO2005085333A1 (ja) * 2004-03-03 2005-09-15 Kaneka Corporation 分子配向が制御された有機絶縁フィルムおよびそれを用いた接着フィルム、フレキシブル金属張積層板、多層フレキシブル金属張積層板、カバーレイフィルム、ｔａｂ用テープ、ｃｏｆ用ベーステープ
WO2005087480A1 (ja) 2004-03-15 2005-09-22 Kaneka Corporation 新規なポリイミドフィルムおよびその利用
JP4597737B2 (ja) * 2004-03-29 2010-12-15 株式会社カネカ 新規なポリイミドフィルムおよびその利用ならびにその製造方法
CN1946823A (zh) * 2004-05-13 2007-04-11 株式会社钟化 粘接薄膜、柔性敷金属叠层板及其制备方法
JP5758457B2 (ja) * 2004-07-15 2015-08-05 株式会社カネカ 接着フィルムの製造方法およびフレキシブル金属張積層板の製造方法
JP5095792B2 (ja) * 2010-09-28 2012-12-12 伊藤忠商事株式会社 樹脂フィルムの熱処理方法
KR101509831B1 (ko) * 2010-12-31 2015-04-08 코오롱인더스트리 주식회사 폴리이미드 필름의 제조방법
CN106647202A (zh) * 2016-12-31 2017-05-10 陈卫权 一种修复硒鼓出粉刀表面覆膜的方法
CN107065485A (zh) * 2016-12-31 2017-08-18 上海宜达胜临港打印耗材有限公司 一种打印机硒鼓再制造的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4886957A (enrdf_load_stackoverflow) * 1972-02-24 1973-11-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10259177B2 (en) 2013-03-29 2019-04-16 Ube Industries, Ltd. Film manufacturing method and manufacturing apparatus

Also Published As

Publication number Publication date
JPS6241024A (ja) 1987-02-23

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