JPH0587180B2 - - Google Patents
Info
- Publication number
- JPH0587180B2 JPH0587180B2 JP63230612A JP23061288A JPH0587180B2 JP H0587180 B2 JPH0587180 B2 JP H0587180B2 JP 63230612 A JP63230612 A JP 63230612A JP 23061288 A JP23061288 A JP 23061288A JP H0587180 B2 JPH0587180 B2 JP H0587180B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- lower substrate
- cavity recess
- adhesive layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23061288A JPH0278252A (ja) | 1988-09-14 | 1988-09-14 | 多層プラスチックチップキャリア |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23061288A JPH0278252A (ja) | 1988-09-14 | 1988-09-14 | 多層プラスチックチップキャリア |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0278252A JPH0278252A (ja) | 1990-03-19 |
| JPH0587180B2 true JPH0587180B2 (enrdf_load_stackoverflow) | 1993-12-15 |
Family
ID=16910491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23061288A Granted JPH0278252A (ja) | 1988-09-14 | 1988-09-14 | 多層プラスチックチップキャリア |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0278252A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5818114A (en) * | 1995-05-26 | 1998-10-06 | Hewlett-Packard Company | Radially staggered bond pad arrangements for integrated circuit pad circuitry |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
| JPS614456U (ja) * | 1984-06-13 | 1986-01-11 | イビデン株式会社 | プラグインパツケ−ジ基板 |
-
1988
- 1988-09-14 JP JP23061288A patent/JPH0278252A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0278252A (ja) | 1990-03-19 |
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