JPH0587037B2 - - Google Patents
Info
- Publication number
- JPH0587037B2 JPH0587037B2 JP27514585A JP27514585A JPH0587037B2 JP H0587037 B2 JPH0587037 B2 JP H0587037B2 JP 27514585 A JP27514585 A JP 27514585A JP 27514585 A JP27514585 A JP 27514585A JP H0587037 B2 JPH0587037 B2 JP H0587037B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- copper foil
- resistant
- soldering
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 claims description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 239000011889 copper foil Substances 0.000 claims description 35
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 20
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27514585A JPS62134995A (ja) | 1985-12-09 | 1985-12-09 | 電子回路基板のハンダ付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27514585A JPS62134995A (ja) | 1985-12-09 | 1985-12-09 | 電子回路基板のハンダ付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62134995A JPS62134995A (ja) | 1987-06-18 |
| JPH0587037B2 true JPH0587037B2 (enrdf_load_stackoverflow) | 1993-12-15 |
Family
ID=17551307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27514585A Granted JPS62134995A (ja) | 1985-12-09 | 1985-12-09 | 電子回路基板のハンダ付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134995A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4733253B2 (ja) * | 2000-09-29 | 2011-07-27 | イビデン株式会社 | プリント配線板 |
-
1985
- 1985-12-09 JP JP27514585A patent/JPS62134995A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62134995A (ja) | 1987-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |