JPH058599B2 - - Google Patents
Info
- Publication number
- JPH058599B2 JPH058599B2 JP59219189A JP21918984A JPH058599B2 JP H058599 B2 JPH058599 B2 JP H058599B2 JP 59219189 A JP59219189 A JP 59219189A JP 21918984 A JP21918984 A JP 21918984A JP H058599 B2 JPH058599 B2 JP H058599B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive
- film
- conductive circuit
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Printing Methods (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21918984A JPS6196794A (ja) | 1984-10-17 | 1984-10-17 | 導電性回路を有する基板の連続製造法 |
| PCT/JP1985/000576 WO1986002519A1 (fr) | 1984-10-17 | 1985-10-16 | Procede de production continue d'un substrat ayant un circuit electriquement conducteur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21918984A JPS6196794A (ja) | 1984-10-17 | 1984-10-17 | 導電性回路を有する基板の連続製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6196794A JPS6196794A (ja) | 1986-05-15 |
| JPH058599B2 true JPH058599B2 (enExample) | 1993-02-02 |
Family
ID=16731599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21918984A Granted JPS6196794A (ja) | 1984-10-17 | 1984-10-17 | 導電性回路を有する基板の連続製造法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6196794A (enExample) |
| WO (1) | WO1986002519A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7651830B2 (en) | 2007-06-01 | 2010-01-26 | 3M Innovative Properties Company | Patterned photoacid etching and articles therefrom |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770895A (en) * | 1995-06-08 | 1998-06-23 | Tokyo Electron Limited | Operation control device and method for a plurality of electric power consuming systems |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS604233B2 (ja) * | 1975-12-26 | 1985-02-02 | 卓馬 桐山 | 粘稠な金属表面処理剤及びその製造方法 |
| JPS591680A (ja) * | 1982-06-25 | 1984-01-07 | Daicel Chem Ind Ltd | 導電性薄膜のエッチング液 |
-
1984
- 1984-10-17 JP JP21918984A patent/JPS6196794A/ja active Granted
-
1985
- 1985-10-16 WO PCT/JP1985/000576 patent/WO1986002519A1/ja not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7651830B2 (en) | 2007-06-01 | 2010-01-26 | 3M Innovative Properties Company | Patterned photoacid etching and articles therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6196794A (ja) | 1986-05-15 |
| WO1986002519A1 (fr) | 1986-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR900008504B1 (ko) | 절연 금속기판의 연속적인 웨브를 제조하기 위한 방법 및 장치 | |
| JP7260923B2 (ja) | 電気工学的薄膜積層体の製造方法 | |
| JPS5854089B2 (ja) | 透明導電膜の形成方法 | |
| JPH058599B2 (enExample) | ||
| CN101481616B (zh) | 金属及金属氧化物蚀刻油墨及其制备方法与应用 | |
| JPS5949305B2 (ja) | 化学めつき前処理方法 | |
| JPS6222312A (ja) | 透明導電性被膜の形成方法 | |
| CN1250347A (zh) | 正温度系数加热器及其制造方法 | |
| JP2742068B2 (ja) | 透明導電性微粒子の製造法及びそれによる透明導電性薄膜の作成方法 | |
| US2842464A (en) | Method of producing an electrical resistance on glass | |
| JPH05234432A (ja) | パターン化した透明導電膜の形成方法 | |
| JP3549089B2 (ja) | 透明導電膜付きガラス基板とその製法 | |
| KR910005115B1 (ko) | 금속판에 세라믹 전열선을 형성시키는 방법 | |
| JP2702713B2 (ja) | 卑金属薄膜の製造方法 | |
| JP2887318B2 (ja) | 金属薄膜抵抗体の製造方法 | |
| JPS639327B2 (enExample) | ||
| CN118047543A (zh) | 半导体纳米发热板正面接地保护制作工艺 | |
| KR920006043B1 (ko) | 스텐레즈 스틸파이프에 에칭무늬를 현출시키는 방법 | |
| JPH01249171A (ja) | 無機酸化物膜を有する基体の製造方法 | |
| JPS63276817A (ja) | 透明導電性回路板の製造法 | |
| JPH053690B2 (enExample) | ||
| JPH0647514B2 (ja) | セラミックスへのめっき処理方法 | |
| JPS63227785A (ja) | パタ−ンの形成方法 | |
| JP3057714B2 (ja) | パターン形成方法 | |
| CN118173322A (zh) | 一种导电膜的制备方法 |