JPH058578B2 - - Google Patents
Info
- Publication number
- JPH058578B2 JPH058578B2 JP58072873A JP7287383A JPH058578B2 JP H058578 B2 JPH058578 B2 JP H058578B2 JP 58072873 A JP58072873 A JP 58072873A JP 7287383 A JP7287383 A JP 7287383A JP H058578 B2 JPH058578 B2 JP H058578B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- film
- oxide film
- capacitor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58072873A JPS59200453A (ja) | 1983-04-27 | 1983-04-27 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58072873A JPS59200453A (ja) | 1983-04-27 | 1983-04-27 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59200453A JPS59200453A (ja) | 1984-11-13 |
| JPH058578B2 true JPH058578B2 (enExample) | 1993-02-02 |
Family
ID=13501876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58072873A Granted JPS59200453A (ja) | 1983-04-27 | 1983-04-27 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59200453A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5462767A (en) * | 1985-09-21 | 1995-10-31 | Semiconductor Energy Laboratory Co., Ltd. | CVD of conformal coatings over a depression using alkylmetal precursors |
| US6037648A (en) * | 1998-06-26 | 2000-03-14 | International Business Machines Corporation | Semiconductor structure including a conductive fuse and process for fabrication thereof |
| JP2000188383A (ja) * | 1998-10-14 | 2000-07-04 | Fujitsu Ltd | 半導体装置およびその製造方法、半導体集積回路およびその製造方法 |
| JP4083397B2 (ja) | 2001-06-18 | 2008-04-30 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| KR100548998B1 (ko) * | 2003-09-25 | 2006-02-02 | 삼성전자주식회사 | 동일레벨에 퓨즈와 커패시터를 갖는 반도체소자 및 그것을제조하는 방법 |
-
1983
- 1983-04-27 JP JP58072873A patent/JPS59200453A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59200453A (ja) | 1984-11-13 |
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