JPH0584671B2 - - Google Patents

Info

Publication number
JPH0584671B2
JPH0584671B2 JP60125418A JP12541885A JPH0584671B2 JP H0584671 B2 JPH0584671 B2 JP H0584671B2 JP 60125418 A JP60125418 A JP 60125418A JP 12541885 A JP12541885 A JP 12541885A JP H0584671 B2 JPH0584671 B2 JP H0584671B2
Authority
JP
Japan
Prior art keywords
metal
contact hole
interlayer film
polycrystalline silicon
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60125418A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61283146A (ja
Inventor
Hiroshi Furuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP12541885A priority Critical patent/JPS61283146A/ja
Publication of JPS61283146A publication Critical patent/JPS61283146A/ja
Publication of JPH0584671B2 publication Critical patent/JPH0584671B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP12541885A 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法 Granted JPS61283146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12541885A JPS61283146A (ja) 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12541885A JPS61283146A (ja) 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS61283146A JPS61283146A (ja) 1986-12-13
JPH0584671B2 true JPH0584671B2 (en, 2012) 1993-12-02

Family

ID=14909610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12541885A Granted JPS61283146A (ja) 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS61283146A (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661081A (en) * 1994-09-30 1997-08-26 United Microelectronics Corporation Method of bonding an aluminum wire to an intergrated circuit bond pad

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745967A (en) * 1980-09-04 1982-03-16 Toshiba Corp Semiconductor device
JPS57166048A (en) * 1981-04-06 1982-10-13 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit
JPS5828856A (ja) * 1981-08-13 1983-02-19 Nec Corp 半導体装置の製造方法
JPS5873135A (ja) * 1981-10-28 1983-05-02 Nec Corp 半導体装置とその製造方法

Also Published As

Publication number Publication date
JPS61283146A (ja) 1986-12-13

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