JPH0584512B2 - - Google Patents

Info

Publication number
JPH0584512B2
JPH0584512B2 JP60022164A JP2216485A JPH0584512B2 JP H0584512 B2 JPH0584512 B2 JP H0584512B2 JP 60022164 A JP60022164 A JP 60022164A JP 2216485 A JP2216485 A JP 2216485A JP H0584512 B2 JPH0584512 B2 JP H0584512B2
Authority
JP
Japan
Prior art keywords
copper
corrosion
photosensitive
resistant film
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60022164A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61180233A (ja
Inventor
Katsutoshi Yanagimoto
Shoichi Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP60022164A priority Critical patent/JPS61180233A/ja
Priority to US06/734,441 priority patent/US4634655A/en
Priority to EP85106277A priority patent/EP0164022A3/en
Priority to KR1019850003761A priority patent/KR890004620B1/ko
Publication of JPS61180233A publication Critical patent/JPS61180233A/ja
Publication of JPH0584512B2 publication Critical patent/JPH0584512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP60022164A 1984-06-04 1985-02-06 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 Granted JPS61180233A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60022164A JPS61180233A (ja) 1985-02-06 1985-02-06 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法
US06/734,441 US4634655A (en) 1984-06-04 1985-05-15 Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy
EP85106277A EP0164022A3 (en) 1984-06-04 1985-05-22 Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy
KR1019850003761A KR890004620B1 (ko) 1984-06-04 1985-05-30 동 또는 동합금 기재표면에의 내부식성 피막형성방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60022164A JPS61180233A (ja) 1985-02-06 1985-02-06 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法

Publications (2)

Publication Number Publication Date
JPS61180233A JPS61180233A (ja) 1986-08-12
JPH0584512B2 true JPH0584512B2 (enrdf_load_stackoverflow) 1993-12-02

Family

ID=12075179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60022164A Granted JPS61180233A (ja) 1984-06-04 1985-02-06 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法

Country Status (1)

Country Link
JP (1) JPS61180233A (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034963A (enrdf_load_stackoverflow) * 1973-07-27 1975-04-03
JPS5114932A (ja) * 1974-07-30 1976-02-05 Kansai Paint Co Ltd Kokaseihifukusoseibutsu
JPS5215321A (en) * 1975-07-28 1977-02-04 Hitachi Ltd Photosensitive resinous composition
JPS52125002A (en) * 1976-04-12 1977-10-20 Ueno Chem Ind Water soluble photoosensitive composition
US4061529A (en) * 1977-02-28 1977-12-06 Rca Corporation Method for making etch-resistant stencil with dichromate-sensitized casein coating

Also Published As

Publication number Publication date
JPS61180233A (ja) 1986-08-12

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