JPS61180233A - 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 - Google Patents
銅又は銅合金からなる基材表面への耐食性皮膜の形成方法Info
- Publication number
- JPS61180233A JPS61180233A JP60022164A JP2216485A JPS61180233A JP S61180233 A JPS61180233 A JP S61180233A JP 60022164 A JP60022164 A JP 60022164A JP 2216485 A JP2216485 A JP 2216485A JP S61180233 A JPS61180233 A JP S61180233A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- resistant film
- photosensitive
- base material
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 26
- 229910052802 copper Inorganic materials 0.000 title claims description 20
- 239000010949 copper Substances 0.000 title claims description 20
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 15
- 230000007797 corrosion Effects 0.000 title claims description 15
- 238000005260 corrosion Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 title abstract description 14
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims description 29
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 11
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 229920003169 water-soluble polymer Polymers 0.000 claims description 7
- JOSWYUNQBRPBDN-UHFFFAOYSA-P ammonium dichromate Chemical compound [NH4+].[NH4+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O JOSWYUNQBRPBDN-UHFFFAOYSA-P 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 17
- 238000005530 etching Methods 0.000 abstract description 13
- 238000000576 coating method Methods 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 11
- 238000011282 treatment Methods 0.000 abstract description 8
- 150000001412 amines Chemical class 0.000 abstract 2
- 238000004299 exfoliation Methods 0.000 abstract 1
- 230000000284 resting effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 11
- 239000002585 base Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- -1 casein Chemical class 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 239000005018 casein Substances 0.000 description 3
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 3
- 235000021240 caseins Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- QCVGEOXPDFCNHA-UHFFFAOYSA-N 5,5-dimethyl-2,4-dioxo-1,3-oxazolidine-3-carboxamide Chemical compound CC1(C)OC(=O)N(C(N)=O)C1=O QCVGEOXPDFCNHA-UHFFFAOYSA-N 0.000 description 1
- XMVQMBLTFKAIOX-UHFFFAOYSA-N 6-azaniumylhexylazanium;dichloride Chemical compound [Cl-].[Cl-].[NH3+]CCCCCC[NH3+] XMVQMBLTFKAIOX-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 102000002322 Egg Proteins Human genes 0.000 description 1
- 108010000912 Egg Proteins Proteins 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000014103 egg white Nutrition 0.000 description 1
- 210000000969 egg white Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/04—Chromates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60022164A JPS61180233A (ja) | 1985-02-06 | 1985-02-06 | 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 |
US06/734,441 US4634655A (en) | 1984-06-04 | 1985-05-15 | Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy |
EP85106277A EP0164022A3 (en) | 1984-06-04 | 1985-05-22 | Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy |
KR1019850003761A KR890004620B1 (ko) | 1984-06-04 | 1985-05-30 | 동 또는 동합금 기재표면에의 내부식성 피막형성방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60022164A JPS61180233A (ja) | 1985-02-06 | 1985-02-06 | 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61180233A true JPS61180233A (ja) | 1986-08-12 |
JPH0584512B2 JPH0584512B2 (enrdf_load_stackoverflow) | 1993-12-02 |
Family
ID=12075179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60022164A Granted JPS61180233A (ja) | 1984-06-04 | 1985-02-06 | 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61180233A (enrdf_load_stackoverflow) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5034963A (enrdf_load_stackoverflow) * | 1973-07-27 | 1975-04-03 | ||
JPS5114932A (ja) * | 1974-07-30 | 1976-02-05 | Kansai Paint Co Ltd | Kokaseihifukusoseibutsu |
JPS5215321A (en) * | 1975-07-28 | 1977-02-04 | Hitachi Ltd | Photosensitive resinous composition |
JPS52125002A (en) * | 1976-04-12 | 1977-10-20 | Ueno Chem Ind | Water soluble photoosensitive composition |
JPS53108429A (en) * | 1977-02-28 | 1978-09-21 | Rca Corp | Method of manufacturing corrosion resistance shading mask |
-
1985
- 1985-02-06 JP JP60022164A patent/JPS61180233A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5034963A (enrdf_load_stackoverflow) * | 1973-07-27 | 1975-04-03 | ||
JPS5114932A (ja) * | 1974-07-30 | 1976-02-05 | Kansai Paint Co Ltd | Kokaseihifukusoseibutsu |
JPS5215321A (en) * | 1975-07-28 | 1977-02-04 | Hitachi Ltd | Photosensitive resinous composition |
JPS52125002A (en) * | 1976-04-12 | 1977-10-20 | Ueno Chem Ind | Water soluble photoosensitive composition |
JPS53108429A (en) * | 1977-02-28 | 1978-09-21 | Rca Corp | Method of manufacturing corrosion resistance shading mask |
Also Published As
Publication number | Publication date |
---|---|
JPH0584512B2 (enrdf_load_stackoverflow) | 1993-12-02 |
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