JPH0418032B2 - - Google Patents
Info
- Publication number
- JPH0418032B2 JPH0418032B2 JP11516984A JP11516984A JPH0418032B2 JP H0418032 B2 JPH0418032 B2 JP H0418032B2 JP 11516984 A JP11516984 A JP 11516984A JP 11516984 A JP11516984 A JP 11516984A JP H0418032 B2 JPH0418032 B2 JP H0418032B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- corrosion
- photosensitive
- resistant film
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 16
- 230000007797 corrosion Effects 0.000 claims description 15
- 238000005260 corrosion Methods 0.000 claims description 15
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 14
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229920003169 water-soluble polymer Polymers 0.000 claims description 5
- JOSWYUNQBRPBDN-UHFFFAOYSA-P ammonium dichromate Chemical compound [NH4+].[NH4+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O JOSWYUNQBRPBDN-UHFFFAOYSA-P 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000002585 base Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- -1 grieux Chemical compound 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/04—Chromates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Treatment Of Metals (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59115169A JPS60258475A (ja) | 1984-06-04 | 1984-06-04 | 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 |
| US06/734,441 US4634655A (en) | 1984-06-04 | 1985-05-15 | Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy |
| EP85106277A EP0164022A3 (en) | 1984-06-04 | 1985-05-22 | Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy |
| KR1019850003761A KR890004620B1 (ko) | 1984-06-04 | 1985-05-30 | 동 또는 동합금 기재표면에의 내부식성 피막형성방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59115169A JPS60258475A (ja) | 1984-06-04 | 1984-06-04 | 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60258475A JPS60258475A (ja) | 1985-12-20 |
| JPH0418032B2 true JPH0418032B2 (enrdf_load_stackoverflow) | 1992-03-26 |
Family
ID=14656048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59115169A Granted JPS60258475A (ja) | 1984-06-04 | 1984-06-04 | 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60258475A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040031473A (ko) * | 2002-10-07 | 2004-04-13 | 씨알씨테크놀러지(주) | 주철제품의 표면처리방법 |
-
1984
- 1984-06-04 JP JP59115169A patent/JPS60258475A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60258475A (ja) | 1985-12-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR890004620B1 (ko) | 동 또는 동합금 기재표면에의 내부식성 피막형성방법 | |
| US4148654A (en) | Positive acting photoresist comprising diazide ester, novolak resin and rosin | |
| JPS62247085A (ja) | フオトエッチング法による金属薄板の加工方法 | |
| IL33863A (en) | Light sensitive compositions | |
| JPH0431381B2 (enrdf_load_stackoverflow) | ||
| US4760014A (en) | Method for treating mixtures containing photopolymeric resin and compositions therefor | |
| US3745011A (en) | Novel photo resist composition containing cyclic polycarboxylic acids | |
| JPH0418032B2 (enrdf_load_stackoverflow) | ||
| JPH02222953A (ja) | 光像形成性組成物及びそれから形成されたドライフィルム | |
| JPH0584512B2 (enrdf_load_stackoverflow) | ||
| US4259421A (en) | Improving etch-resistance of casein-based photoresist pattern | |
| US3620735A (en) | Relief image process utilizing a simple and a complex ferric salt | |
| JPH04361265A (ja) | 剥離液 | |
| US4237210A (en) | Aqueous photoresist method | |
| US4158566A (en) | Aqueous photoresist comprising casein and methylol acrylamide | |
| US3118765A (en) | Lithographic product comprising lightsensitive diazido stilbene sulfonic acid salt | |
| JPH05241353A (ja) | 水溶性フォトレジストパターンの硬膜処理方法 | |
| JPS616827A (ja) | フオトレジストのストリツパー | |
| JPS6126787A (ja) | 銅材のフオトエツチング方法 | |
| JP3277028B2 (ja) | フォトレジストパターニング被膜の硬膜処理剤および硬膜処理方法 | |
| US2411108A (en) | Developing colloid resists with substantive dyes | |
| EP0024872A1 (en) | A method of treating exposed and developed radiation sensitive plates in lithographic printing plate production, compositions for use in the method, and the use of diazo eliminating compounds in improving the ink receptivity of lithographic printing images | |
| DE2001548A1 (de) | Verfahren zum Erhoehen der Haftung von Polymeren auf Metallen | |
| JPH01251536A (ja) | シャドウマスクの製造方法 | |
| US3520746A (en) | Metal etch compositions |