JPH05833B2 - - Google Patents

Info

Publication number
JPH05833B2
JPH05833B2 JP62122464A JP12246487A JPH05833B2 JP H05833 B2 JPH05833 B2 JP H05833B2 JP 62122464 A JP62122464 A JP 62122464A JP 12246487 A JP12246487 A JP 12246487A JP H05833 B2 JPH05833 B2 JP H05833B2
Authority
JP
Japan
Prior art keywords
circuit
wiring member
circuit wiring
manufacturing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62122464A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63289784A (ja
Inventor
Naoshi Kato
Nobuhito Nakazato
Juichi Nishama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Ryosei Electro Circuit Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryosei Electro Circuit Systems Ltd filed Critical Ryosei Electro Circuit Systems Ltd
Priority to JP62122464A priority Critical patent/JPS63289784A/ja
Publication of JPS63289784A publication Critical patent/JPS63289784A/ja
Publication of JPH05833B2 publication Critical patent/JPH05833B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
JP62122464A 1987-05-21 1987-05-21 回路配線部材の製造方法 Granted JPS63289784A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62122464A JPS63289784A (ja) 1987-05-21 1987-05-21 回路配線部材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62122464A JPS63289784A (ja) 1987-05-21 1987-05-21 回路配線部材の製造方法

Publications (2)

Publication Number Publication Date
JPS63289784A JPS63289784A (ja) 1988-11-28
JPH05833B2 true JPH05833B2 (enrdf_load_stackoverflow) 1993-01-06

Family

ID=14836503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62122464A Granted JPS63289784A (ja) 1987-05-21 1987-05-21 回路配線部材の製造方法

Country Status (1)

Country Link
JP (1) JPS63289784A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS63289784A (ja) 1988-11-28

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees