JPS63289784A - 回路配線部材の製造方法 - Google Patents
回路配線部材の製造方法Info
- Publication number
- JPS63289784A JPS63289784A JP62122464A JP12246487A JPS63289784A JP S63289784 A JPS63289784 A JP S63289784A JP 62122464 A JP62122464 A JP 62122464A JP 12246487 A JP12246487 A JP 12246487A JP S63289784 A JPS63289784 A JP S63289784A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate
- circuit wiring
- wiring member
- positions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62122464A JPS63289784A (ja) | 1987-05-21 | 1987-05-21 | 回路配線部材の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62122464A JPS63289784A (ja) | 1987-05-21 | 1987-05-21 | 回路配線部材の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63289784A true JPS63289784A (ja) | 1988-11-28 |
JPH05833B2 JPH05833B2 (enrdf_load_stackoverflow) | 1993-01-06 |
Family
ID=14836503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62122464A Granted JPS63289784A (ja) | 1987-05-21 | 1987-05-21 | 回路配線部材の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63289784A (enrdf_load_stackoverflow) |
-
1987
- 1987-05-21 JP JP62122464A patent/JPS63289784A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH05833B2 (enrdf_load_stackoverflow) | 1993-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |