JPH0582972B2 - - Google Patents
Info
- Publication number
- JPH0582972B2 JPH0582972B2 JP61291157A JP29115786A JPH0582972B2 JP H0582972 B2 JPH0582972 B2 JP H0582972B2 JP 61291157 A JP61291157 A JP 61291157A JP 29115786 A JP29115786 A JP 29115786A JP H0582972 B2 JPH0582972 B2 JP H0582972B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe needle
- electrode pad
- wafer
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61291157A JPS63142826A (ja) | 1986-12-05 | 1986-12-05 | プロ−ブカ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61291157A JPS63142826A (ja) | 1986-12-05 | 1986-12-05 | プロ−ブカ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63142826A JPS63142826A (ja) | 1988-06-15 |
| JPH0582972B2 true JPH0582972B2 (enExample) | 1993-11-24 |
Family
ID=17765182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61291157A Granted JPS63142826A (ja) | 1986-12-05 | 1986-12-05 | プロ−ブカ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63142826A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2929948B2 (ja) * | 1994-09-20 | 1999-08-03 | 三菱電機株式会社 | プローブ式テストハンドラー及びそれを用いたicのテスト方法 |
| FR2769753B1 (fr) * | 1997-10-09 | 1999-12-03 | Commissariat Energie Atomique | Caracterisation electrique d'une couche isolante recouvrant un substrat conducteur ou semiconducteur |
| EP1587113B1 (en) * | 2004-04-15 | 2012-10-03 | Fei Company | Stylus system for modifying small structures |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040550U (enExample) * | 1973-08-04 | 1975-04-24 | ||
| JPS5569058A (en) * | 1978-11-20 | 1980-05-24 | Fujitsu Ltd | Contact method for probe |
| JPS57115841A (en) * | 1981-01-10 | 1982-07-19 | Nec Corp | Probing method |
| JPS58169068A (ja) * | 1982-03-31 | 1983-10-05 | Toshiba Corp | 半導体装置の特性測定方法 |
| JPS58148935U (ja) * | 1982-03-31 | 1983-10-06 | 日本電子材料株式会社 | プロ−ブカ−ド |
-
1986
- 1986-12-05 JP JP61291157A patent/JPS63142826A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63142826A (ja) | 1988-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3208734B2 (ja) | プローブ装置 | |
| KR100470970B1 (ko) | 반도체 검사장치용 프로브카드의 니들고정장치 및 방법 | |
| US5773987A (en) | Method for probing a semiconductor wafer using a motor controlled scrub process | |
| KR100458330B1 (ko) | 프로브 카드 장치 및 그것에 사용되는 프로브 | |
| JPH11288984A (ja) | 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法 | |
| JP3616236B2 (ja) | プローブカードおよびそれを用いたウエハテスト方法 | |
| KR102127728B1 (ko) | 개선된 그립핑 구조를 가지는 프로브 핀 | |
| JP2010040856A (ja) | プロービング装置 | |
| KR20000024688A (ko) | 수직형미세탐침카드 | |
| JPH0582972B2 (enExample) | ||
| JPS5833700B2 (ja) | 固定プロ−ブ・ボ−ド | |
| CN107505485B (zh) | 接触探针、半导体元件试验装置及半导体元件试验方法 | |
| JP2711855B2 (ja) | プローブ装置および検査方法 | |
| JP2000206148A (ja) | プロ―ブカ―ド及びそのプロ―ブカ―ドを用いたプロ―ビング方法 | |
| JPH01295185A (ja) | 検査装置 | |
| JPH1174322A (ja) | ウエハプローバー | |
| JPS62238633A (ja) | 半導体ウエ−ハの電気的特性測定用プロ−ブ針 | |
| JPH07288271A (ja) | 集積回路用測定電極 | |
| JP2000074990A (ja) | 半導体チップ用パッケージの良否検査方法及びその装置 | |
| JPS63262849A (ja) | プロ−ブカ−ド | |
| JPH06124985A (ja) | プローブ装置及びプロービング方法 | |
| JPH04342150A (ja) | 半導体装置の検査方法 | |
| JPH05160210A (ja) | プローブ装置 | |
| JP2004061344A (ja) | 半導体素子の試験方法 | |
| JP2000294605A (ja) | 半導体装置及びその試験装置、並びに試験方法 |