JPH0582966B2 - - Google Patents

Info

Publication number
JPH0582966B2
JPH0582966B2 JP60231756A JP23175685A JPH0582966B2 JP H0582966 B2 JPH0582966 B2 JP H0582966B2 JP 60231756 A JP60231756 A JP 60231756A JP 23175685 A JP23175685 A JP 23175685A JP H0582966 B2 JPH0582966 B2 JP H0582966B2
Authority
JP
Japan
Prior art keywords
wax
temperature
wafer
pressing
adhesive plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60231756A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6290944A (ja
Inventor
Takashi Araki
Kazuo Sato
Masaharu Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP60231756A priority Critical patent/JPS6290944A/ja
Publication of JPS6290944A publication Critical patent/JPS6290944A/ja
Publication of JPH0582966B2 publication Critical patent/JPH0582966B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP60231756A 1985-10-17 1985-10-17 シリコンウエハ貼付装置 Granted JPS6290944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60231756A JPS6290944A (ja) 1985-10-17 1985-10-17 シリコンウエハ貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60231756A JPS6290944A (ja) 1985-10-17 1985-10-17 シリコンウエハ貼付装置

Publications (2)

Publication Number Publication Date
JPS6290944A JPS6290944A (ja) 1987-04-25
JPH0582966B2 true JPH0582966B2 (enrdf_load_stackoverflow) 1993-11-24

Family

ID=16928539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60231756A Granted JPS6290944A (ja) 1985-10-17 1985-10-17 シリコンウエハ貼付装置

Country Status (1)

Country Link
JP (1) JPS6290944A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH078130Y2 (ja) * 1987-04-30 1995-03-01 日立電線株式会社 ＧａＡｓウェハの貼付装置
JP2534210B2 (ja) * 1989-04-03 1996-09-11 三菱電機株式会社 ウエハ剥し装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931213B2 (ja) * 1977-11-18 1984-07-31 三菱電機株式会社 半導体ウエハのラツプ定盤への接着方法
JPS5932135A (ja) * 1982-08-18 1984-02-21 Toshiba Corp 半導体ウエハの接着装置

Also Published As

Publication number Publication date
JPS6290944A (ja) 1987-04-25

Similar Documents

Publication Publication Date Title
CN106733487B (zh) 一种芯片涂胶装置及方法
JPH081898B2 (ja) ウエハ貼付装置
JPH0582966B2 (enrdf_load_stackoverflow)
JPS61289964A (ja) ろう付け方法
JP2001126851A (ja) 半導体ウエハーにおけるヒータ装置およびその製造方法
JPH11186338A (ja) ボンディング装置
JPH07130795A (ja) 半導体素子接続方法および半導体素子接続装置
JPS63123645A (ja) 半導体装置の製造方法
JPH05291217A (ja) ウエハーと取付け板の接着設備
JPH07288267A (ja) アウターリードボンディング装置
JPS6014485B2 (ja) 避雷器用素子の接着方法
JPS6049637A (ja) 半導体基板のマウント方法
JPH09142948A (ja) セラミックス構造体の接合方法
JPS6331886Y2 (enrdf_load_stackoverflow)
JP3747849B2 (ja) 電子部品のボンディング装置およびボンディング方法
JP2699583B2 (ja) 半導体装置の製造方法及びその装置
JPS6297341A (ja) ボンディング装置及びボンディング方法
JPS6319309B2 (enrdf_load_stackoverflow)
JPS6263061A (ja) ウエハ貼付プレ−トの加熱方法
JPH04191035A (ja) フイルム部品接合装置
JP2661439B2 (ja) ボンディング方法およびその治具
JP3348261B2 (ja) 基板の貼り合わせ方法
JP2848971B2 (ja) 薄板の接着方法
JPH04273454A (ja) ボンディング工具
JPS63221970A (ja) 半導体ウエハの研磨方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees