JPS6319309B2 - - Google Patents

Info

Publication number
JPS6319309B2
JPS6319309B2 JP58058754A JP5875483A JPS6319309B2 JP S6319309 B2 JPS6319309 B2 JP S6319309B2 JP 58058754 A JP58058754 A JP 58058754A JP 5875483 A JP5875483 A JP 5875483A JP S6319309 B2 JPS6319309 B2 JP S6319309B2
Authority
JP
Japan
Prior art keywords
polishing
mounting plate
insulator
wax
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58058754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59187455A (ja
Inventor
Susumu Matsuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58058754A priority Critical patent/JPS59187455A/ja
Publication of JPS59187455A publication Critical patent/JPS59187455A/ja
Publication of JPS6319309B2 publication Critical patent/JPS6319309B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Element Separation (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP58058754A 1983-04-05 1983-04-05 絶縁物分離基板の研磨方法 Granted JPS59187455A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58058754A JPS59187455A (ja) 1983-04-05 1983-04-05 絶縁物分離基板の研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58058754A JPS59187455A (ja) 1983-04-05 1983-04-05 絶縁物分離基板の研磨方法

Publications (2)

Publication Number Publication Date
JPS59187455A JPS59187455A (ja) 1984-10-24
JPS6319309B2 true JPS6319309B2 (enrdf_load_stackoverflow) 1988-04-22

Family

ID=13093321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58058754A Granted JPS59187455A (ja) 1983-04-05 1983-04-05 絶縁物分離基板の研磨方法

Country Status (1)

Country Link
JP (1) JPS59187455A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JP3124085B2 (ja) * 1991-12-02 2001-01-15 沖電気工業株式会社 半導体装置
CN102343546A (zh) * 2011-10-10 2012-02-08 沈阳理工大学 烧结聚晶金刚石冷板冷却高速研磨方法
JP2015196224A (ja) * 2014-04-01 2015-11-09 株式会社フジミインコーポレーテッド 研磨方法、及び保持具

Also Published As

Publication number Publication date
JPS59187455A (ja) 1984-10-24

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