JPS59187455A - 絶縁物分離基板の研磨方法 - Google Patents
絶縁物分離基板の研磨方法Info
- Publication number
- JPS59187455A JPS59187455A JP58058754A JP5875483A JPS59187455A JP S59187455 A JPS59187455 A JP S59187455A JP 58058754 A JP58058754 A JP 58058754A JP 5875483 A JP5875483 A JP 5875483A JP S59187455 A JPS59187455 A JP S59187455A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- mounting plate
- cooling water
- plate
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007517 polishing process Methods 0.000 title description 2
- 238000005498 polishing Methods 0.000 claims abstract description 67
- 239000000498 cooling water Substances 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 38
- 239000012212 insulator Substances 0.000 claims description 31
- 238000000926 separation method Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Element Separation (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58058754A JPS59187455A (ja) | 1983-04-05 | 1983-04-05 | 絶縁物分離基板の研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58058754A JPS59187455A (ja) | 1983-04-05 | 1983-04-05 | 絶縁物分離基板の研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59187455A true JPS59187455A (ja) | 1984-10-24 |
| JPS6319309B2 JPS6319309B2 (enrdf_load_stackoverflow) | 1988-04-22 |
Family
ID=13093321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58058754A Granted JPS59187455A (ja) | 1983-04-05 | 1983-04-05 | 絶縁物分離基板の研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59187455A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036630A (en) * | 1990-04-13 | 1991-08-06 | International Business Machines Corporation | Radial uniformity control of semiconductor wafer polishing |
| US5387817A (en) * | 1991-12-02 | 1995-02-07 | Oki Electric Industry Co., Ltd. | Dielectric isolation substrate having single-crystal silicon islands surrounded by groove and lower conductive layer filling the groove therewith |
| CN102343546A (zh) * | 2011-10-10 | 2012-02-08 | 沈阳理工大学 | 烧结聚晶金刚石冷板冷却高速研磨方法 |
| JP2015196224A (ja) * | 2014-04-01 | 2015-11-09 | 株式会社フジミインコーポレーテッド | 研磨方法、及び保持具 |
-
1983
- 1983-04-05 JP JP58058754A patent/JPS59187455A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036630A (en) * | 1990-04-13 | 1991-08-06 | International Business Machines Corporation | Radial uniformity control of semiconductor wafer polishing |
| US5387817A (en) * | 1991-12-02 | 1995-02-07 | Oki Electric Industry Co., Ltd. | Dielectric isolation substrate having single-crystal silicon islands surrounded by groove and lower conductive layer filling the groove therewith |
| CN102343546A (zh) * | 2011-10-10 | 2012-02-08 | 沈阳理工大学 | 烧结聚晶金刚石冷板冷却高速研磨方法 |
| JP2015196224A (ja) * | 2014-04-01 | 2015-11-09 | 株式会社フジミインコーポレーテッド | 研磨方法、及び保持具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6319309B2 (enrdf_load_stackoverflow) | 1988-04-22 |
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