JPS6290944A - シリコンウエハ貼付装置 - Google Patents
シリコンウエハ貼付装置Info
- Publication number
- JPS6290944A JPS6290944A JP60231756A JP23175685A JPS6290944A JP S6290944 A JPS6290944 A JP S6290944A JP 60231756 A JP60231756 A JP 60231756A JP 23175685 A JP23175685 A JP 23175685A JP S6290944 A JPS6290944 A JP S6290944A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- wafer
- plate
- heaters
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 7
- 229910052710 silicon Inorganic materials 0.000 title claims description 7
- 239000010703 silicon Substances 0.000 title claims description 7
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 33
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231756A JPS6290944A (ja) | 1985-10-17 | 1985-10-17 | シリコンウエハ貼付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231756A JPS6290944A (ja) | 1985-10-17 | 1985-10-17 | シリコンウエハ貼付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6290944A true JPS6290944A (ja) | 1987-04-25 |
| JPH0582966B2 JPH0582966B2 (enrdf_load_stackoverflow) | 1993-11-24 |
Family
ID=16928539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60231756A Granted JPS6290944A (ja) | 1985-10-17 | 1985-10-17 | シリコンウエハ貼付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6290944A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63172561U (enrdf_load_stackoverflow) * | 1987-04-30 | 1988-11-09 | ||
| JPH02263437A (ja) * | 1989-04-03 | 1990-10-26 | Mitsubishi Electric Corp | ウエハ剥し装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471980A (en) * | 1977-11-18 | 1979-06-08 | Mitsubishi Electric Corp | Adhesion method of semiconductor wafer to lapping surface plate |
| JPS5932135A (ja) * | 1982-08-18 | 1984-02-21 | Toshiba Corp | 半導体ウエハの接着装置 |
-
1985
- 1985-10-17 JP JP60231756A patent/JPS6290944A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471980A (en) * | 1977-11-18 | 1979-06-08 | Mitsubishi Electric Corp | Adhesion method of semiconductor wafer to lapping surface plate |
| JPS5932135A (ja) * | 1982-08-18 | 1984-02-21 | Toshiba Corp | 半導体ウエハの接着装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63172561U (enrdf_load_stackoverflow) * | 1987-04-30 | 1988-11-09 | ||
| JPH02263437A (ja) * | 1989-04-03 | 1990-10-26 | Mitsubishi Electric Corp | ウエハ剥し装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582966B2 (enrdf_load_stackoverflow) | 1993-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |