JPH0581867B2 - - Google Patents

Info

Publication number
JPH0581867B2
JPH0581867B2 JP63238055A JP23805588A JPH0581867B2 JP H0581867 B2 JPH0581867 B2 JP H0581867B2 JP 63238055 A JP63238055 A JP 63238055A JP 23805588 A JP23805588 A JP 23805588A JP H0581867 B2 JPH0581867 B2 JP H0581867B2
Authority
JP
Japan
Prior art keywords
component
probe pin
pin
defective
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63238055A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0287082A (ja
Inventor
Seiichi Hori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hioki EE Corp
Original Assignee
Hioki EE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hioki EE Corp filed Critical Hioki EE Corp
Priority to JP63238055A priority Critical patent/JPH0287082A/ja
Publication of JPH0287082A publication Critical patent/JPH0287082A/ja
Publication of JPH0581867B2 publication Critical patent/JPH0581867B2/ja
Granted legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

Landscapes

  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP63238055A 1988-09-23 1988-09-23 プローブピン接触不良判断機能を有するインサーキットテスタ Granted JPH0287082A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63238055A JPH0287082A (ja) 1988-09-23 1988-09-23 プローブピン接触不良判断機能を有するインサーキットテスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63238055A JPH0287082A (ja) 1988-09-23 1988-09-23 プローブピン接触不良判断機能を有するインサーキットテスタ

Publications (2)

Publication Number Publication Date
JPH0287082A JPH0287082A (ja) 1990-03-27
JPH0581867B2 true JPH0581867B2 (ko) 1993-11-16

Family

ID=17024494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63238055A Granted JPH0287082A (ja) 1988-09-23 1988-09-23 プローブピン接触不良判断機能を有するインサーキットテスタ

Country Status (1)

Country Link
JP (1) JPH0287082A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4999143B2 (ja) * 2005-12-28 2012-08-15 日本電産リード株式会社 基板検査装置
JP5389541B2 (ja) * 2008-11-27 2014-01-15 日置電機株式会社 基板検査装置

Also Published As

Publication number Publication date
JPH0287082A (ja) 1990-03-27

Similar Documents

Publication Publication Date Title
US5736862A (en) System for detecting faults in connections between integrated circuits and circuit board traces
US5521513A (en) Manufacturing defect analyzer
US4290015A (en) Electrical validator for a printed circuit board test fixture and a method of validation thereof
KR19990036063A (ko) 집적회로 내부의 도체를 포함하는 결선을 검사하는 방법 및 그 집적회로
JPH0581867B2 (ko)
JP3784479B2 (ja) 回路基板検査方法
JPH09203765A (ja) ビジュアル併用型基板検査装置
JPH10160800A (ja) 診断情報発生装置及び方法
JP3276755B2 (ja) 実装部品のリードの半田付け不良検出方法
JPH07104026A (ja) 実装部品の半田付け不良検出方法
JP3241777B2 (ja) インサーキットテスタ用オープンテスト装置
JPH10142281A (ja) 回路基板検査方法
JPH07244105A (ja) 実装基板の基板検査装置によるブリッジ半田検出方法
JP2014020815A (ja) 基板検査装置および基板検査方法
JPH04315068A (ja) プリント回路板の検査装置
JP2765096B2 (ja) 電気系コネクタの接続良否診断装置及び診断方法
JP2575640Y2 (ja) 半導体素子の検査装置
JPH0421106Y2 (ko)
KR20020094117A (ko) 인쇄회로기판상의 저항 인덕터 및 커패시터 병렬 회로의검사를 위한 방법
JPH0511022A (ja) 回路基板検査装置
JPS63147666A (ja) サ−マルヘツド基板の検査装置
JPH0267972A (ja) 回路基板検査方法
JPH0269683A (ja) 回路基板検査方法
JP4490005B2 (ja) プリント回路板の試験方法及び試験装置
JPH05341006A (ja) プリント回路板診断装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term