JPH058106Y2 - - Google Patents
Info
- Publication number
- JPH058106Y2 JPH058106Y2 JP1988147768U JP14776888U JPH058106Y2 JP H058106 Y2 JPH058106 Y2 JP H058106Y2 JP 1988147768 U JP1988147768 U JP 1988147768U JP 14776888 U JP14776888 U JP 14776888U JP H058106 Y2 JPH058106 Y2 JP H058106Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- molds
- resin
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 59
- 229920005989 resin Polymers 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000000465 moulding Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988147768U JPH058106Y2 (US07655688-20100202-C00548.png) | 1988-11-11 | 1988-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988147768U JPH058106Y2 (US07655688-20100202-C00548.png) | 1988-11-11 | 1988-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268114U JPH0268114U (US07655688-20100202-C00548.png) | 1990-05-23 |
| JPH058106Y2 true JPH058106Y2 (US07655688-20100202-C00548.png) | 1993-03-01 |
Family
ID=31418477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988147768U Expired - Lifetime JPH058106Y2 (US07655688-20100202-C00548.png) | 1988-11-11 | 1988-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058106Y2 (US07655688-20100202-C00548.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5234884B2 (ja) * | 2006-12-20 | 2013-07-10 | 住友重機械工業株式会社 | 樹脂封止金型 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147369A (en) * | 1974-10-21 | 1976-04-22 | Hitachi Ltd | Jushifushi nyoru handotaisochino seizoho |
| JPS54152970A (en) * | 1978-05-24 | 1979-12-01 | Hitachi Ltd | Resin-molding method, mold and molded body |
| JPS61146517A (ja) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | 半導体装置の樹脂封止用金型 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56154046U (US07655688-20100202-C00548.png) * | 1980-04-10 | 1981-11-18 | ||
| JPS6451326A (en) * | 1987-08-21 | 1989-02-27 | Toa Nenryo Kogyo Kk | Production of superconducting material |
-
1988
- 1988-11-11 JP JP1988147768U patent/JPH058106Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147369A (en) * | 1974-10-21 | 1976-04-22 | Hitachi Ltd | Jushifushi nyoru handotaisochino seizoho |
| JPS54152970A (en) * | 1978-05-24 | 1979-12-01 | Hitachi Ltd | Resin-molding method, mold and molded body |
| JPS61146517A (ja) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | 半導体装置の樹脂封止用金型 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0268114U (US07655688-20100202-C00548.png) | 1990-05-23 |
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