JPH0579170B2 - - Google Patents

Info

Publication number
JPH0579170B2
JPH0579170B2 JP61048391A JP4839186A JPH0579170B2 JP H0579170 B2 JPH0579170 B2 JP H0579170B2 JP 61048391 A JP61048391 A JP 61048391A JP 4839186 A JP4839186 A JP 4839186A JP H0579170 B2 JPH0579170 B2 JP H0579170B2
Authority
JP
Japan
Prior art keywords
solder
spacer
height
semiconductor element
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61048391A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62206843A (ja
Inventor
Shinobu Taima
Kiichiro Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Consumer Electronics Co Ltd
Japan Display Inc
Original Assignee
Hitachi Device Engineering Co Ltd
Hitachi Ltd
Hitachi Consumer Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Device Engineering Co Ltd, Hitachi Ltd, Hitachi Consumer Electronics Co Ltd filed Critical Hitachi Device Engineering Co Ltd
Priority to JP4839186A priority Critical patent/JPS62206843A/ja
Publication of JPS62206843A publication Critical patent/JPS62206843A/ja
Publication of JPH0579170B2 publication Critical patent/JPH0579170B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165Alignment aids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009Pre-treatment of the bump connector or the bonding area
    • H01L2224/8103Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector
    • H01L2224/81035Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector by heating means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009Pre-treatment of the bump connector or the bonding area
    • H01L2224/8103Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector
    • H01L2224/81047Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector by mechanical means, e.g. severing, pressing, stamping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112Aligning
    • H01L2224/81136Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114Guiding structures outside the body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Landscapes

  • Wire Bonding (AREA)
JP4839186A 1986-03-07 1986-03-07 半導体素子接続方法 Granted JPS62206843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4839186A JPS62206843A (ja) 1986-03-07 1986-03-07 半導体素子接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4839186A JPS62206843A (ja) 1986-03-07 1986-03-07 半導体素子接続方法

Publications (2)

Publication Number Publication Date
JPS62206843A JPS62206843A (ja) 1987-09-11
JPH0579170B2 true JPH0579170B2 (fr) 1993-11-01

Family

ID=12801993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4839186A Granted JPS62206843A (ja) 1986-03-07 1986-03-07 半導体素子接続方法

Country Status (1)

Country Link
JP (1) JPS62206843A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014148634A1 (fr) 2013-03-21 2014-09-25 株式会社谷黒組 Dispositif et procédé de brasage, et substrat et composant électronique manufacturés

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173953A (en) * 1981-04-21 1982-10-26 Seiko Epson Corp Semiconductor device
JPS57176738A (en) * 1981-04-23 1982-10-30 Seiko Epson Corp Connecting structure for flip chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173953A (en) * 1981-04-21 1982-10-26 Seiko Epson Corp Semiconductor device
JPS57176738A (en) * 1981-04-23 1982-10-30 Seiko Epson Corp Connecting structure for flip chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014148634A1 (fr) 2013-03-21 2014-09-25 株式会社谷黒組 Dispositif et procédé de brasage, et substrat et composant électronique manufacturés
KR20150133185A (ko) * 2013-03-21 2015-11-27 가부시키가이샤 다니구로구미 납땜장치와 방법 및 제조된 기판과 전자부품
EP2978287A4 (fr) * 2013-03-21 2017-02-08 Tanigurogumi Corporation Dispositif et procédé de brasage, et substrat et composant électronique manufacturés

Also Published As

Publication number Publication date
JPS62206843A (ja) 1987-09-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees