JPH057871B2 - - Google Patents
Info
- Publication number
- JPH057871B2 JPH057871B2 JP61261824A JP26182486A JPH057871B2 JP H057871 B2 JPH057871 B2 JP H057871B2 JP 61261824 A JP61261824 A JP 61261824A JP 26182486 A JP26182486 A JP 26182486A JP H057871 B2 JPH057871 B2 JP H057871B2
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- adhesive
- solid
- imaging device
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261824A JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261824A JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63116462A JPS63116462A (ja) | 1988-05-20 |
| JPH057871B2 true JPH057871B2 (cg-RX-API-DMAC7.html) | 1993-01-29 |
Family
ID=17367240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61261824A Granted JPS63116462A (ja) | 1986-11-05 | 1986-11-05 | 固体撮像装置のシ−リング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63116462A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2047486C (en) * | 1990-07-21 | 2002-03-05 | Shigeru Katayama | Semiconductor device and method for manufacturing the same |
| EP2915680B1 (en) * | 2011-03-25 | 2019-03-13 | Max Co., Ltd. | Long medium having a trailing-end mark and a printing apparatus |
-
1986
- 1986-11-05 JP JP61261824A patent/JPS63116462A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63116462A (ja) | 1988-05-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |