JPS63116462A - 固体撮像装置のシ−リング方法 - Google Patents

固体撮像装置のシ−リング方法

Info

Publication number
JPS63116462A
JPS63116462A JP61261824A JP26182486A JPS63116462A JP S63116462 A JPS63116462 A JP S63116462A JP 61261824 A JP61261824 A JP 61261824A JP 26182486 A JP26182486 A JP 26182486A JP S63116462 A JPS63116462 A JP S63116462A
Authority
JP
Japan
Prior art keywords
glass plate
solid
adhesive
sheet
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61261824A
Other languages
English (en)
Japanese (ja)
Other versions
JPH057871B2 (cg-RX-API-DMAC7.html
Inventor
Yukinori Sakumoto
作本　征則
Takeshi Shima
島　武志
Atsushi Koshimura
淳 越村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP61261824A priority Critical patent/JPS63116462A/ja
Publication of JPS63116462A publication Critical patent/JPS63116462A/ja
Publication of JPH057871B2 publication Critical patent/JPH057871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP61261824A 1986-11-05 1986-11-05 固体撮像装置のシ−リング方法 Granted JPS63116462A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61261824A JPS63116462A (ja) 1986-11-05 1986-11-05 固体撮像装置のシ−リング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61261824A JPS63116462A (ja) 1986-11-05 1986-11-05 固体撮像装置のシ−リング方法

Publications (2)

Publication Number Publication Date
JPS63116462A true JPS63116462A (ja) 1988-05-20
JPH057871B2 JPH057871B2 (cg-RX-API-DMAC7.html) 1993-01-29

Family

ID=17367240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61261824A Granted JPS63116462A (ja) 1986-11-05 1986-11-05 固体撮像装置のシ−リング方法

Country Status (1)

Country Link
JP (1) JPS63116462A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343076A (en) * 1990-07-21 1994-08-30 Mitsui Petrochemical Industries, Ltd. Semiconductor device with an airtight space formed internally within a hollow package
JP4771023B1 (ja) * 2011-03-25 2011-09-14 マックス株式会社 長尺媒体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343076A (en) * 1990-07-21 1994-08-30 Mitsui Petrochemical Industries, Ltd. Semiconductor device with an airtight space formed internally within a hollow package
US6048754A (en) * 1990-07-21 2000-04-11 Mitsui Chemicals, Inc. Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package
JP4771023B1 (ja) * 2011-03-25 2011-09-14 マックス株式会社 長尺媒体

Also Published As

Publication number Publication date
JPH057871B2 (cg-RX-API-DMAC7.html) 1993-01-29

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Legal Events

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EXPY Cancellation because of completion of term