JPH0577196B2 - - Google Patents
Info
- Publication number
- JPH0577196B2 JPH0577196B2 JP421286A JP421286A JPH0577196B2 JP H0577196 B2 JPH0577196 B2 JP H0577196B2 JP 421286 A JP421286 A JP 421286A JP 421286 A JP421286 A JP 421286A JP H0577196 B2 JPH0577196 B2 JP H0577196B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- heat
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- 239000004033 plastic Substances 0.000 claims description 15
- 229920003023 plastic Polymers 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 230000009477 glass transition Effects 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005266 casting Methods 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 8
- 229920000515 polycarbonate Polymers 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 239000006082 mold release agent Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000004593 Epoxy Chemical class 0.000 description 4
- 238000012644 addition polymerization Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- -1 isocyanate compounds Chemical class 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- WYEOPIGTAMXOST-UHFFFAOYSA-N 1-[4-[2-[4-(2,5-dioxopyrrol-1-yl)phenyl]propan-2-yl]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1N1C(=O)C=CC1=O WYEOPIGTAMXOST-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000004643 cyanate ester Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000011505 plaster Substances 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- BDPMIHVEHJUJIW-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanediamine Chemical compound C=1C=CC(Cl)=C(Cl)C=1C(N)(N)C1=CC=CC=C1 BDPMIHVEHJUJIW-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical class O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HKKDKUMUWRTAIA-UHFFFAOYSA-N nitridooxidocarbon(.) Chemical class [O]C#N HKKDKUMUWRTAIA-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP421286A JPS62163388A (ja) | 1986-01-14 | 1986-01-14 | プラスチツク成形プリント配線板の製造法 |
| DE19863613006 DE3613006A1 (de) | 1985-04-17 | 1986-04-17 | Starre harzform |
| DE19873700902 DE3700902A1 (de) | 1986-01-14 | 1987-01-14 | Verfahren zur herstellung von plastikgeformten, gedruckten schaltplatten |
| US07/003,344 US4764327A (en) | 1986-01-14 | 1987-01-14 | Process of producing plastic-molded printed circuit boards |
| US07/029,581 US4740343A (en) | 1985-04-17 | 1987-03-25 | Method for producing rigid resin molds |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP421286A JPS62163388A (ja) | 1986-01-14 | 1986-01-14 | プラスチツク成形プリント配線板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62163388A JPS62163388A (ja) | 1987-07-20 |
| JPH0577196B2 true JPH0577196B2 (enrdf_load_html_response) | 1993-10-26 |
Family
ID=11578316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP421286A Granted JPS62163388A (ja) | 1985-04-17 | 1986-01-14 | プラスチツク成形プリント配線板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163388A (enrdf_load_html_response) |
-
1986
- 1986-01-14 JP JP421286A patent/JPS62163388A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62163388A (ja) | 1987-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4740343A (en) | Method for producing rigid resin molds | |
| US4590115A (en) | Metallizing of plastic substrata | |
| US8609767B2 (en) | Thermosetting resins with gelled nanometer-sized rubber particles | |
| US4764327A (en) | Process of producing plastic-molded printed circuit boards | |
| CN102585443A (zh) | 轻质高强浮力材料及其制备方法 | |
| CN106189087A (zh) | 低介电poss型环氧树脂复合材料及其制备方法 | |
| CN102351170B (zh) | 一种高强度树脂基泡沫炭材料的制备方法 | |
| JPWO2016152623A1 (ja) | 樹脂成形体及びその製造方法 | |
| CN106832281B (zh) | 可室温定型耐高温液体改性双马来酰亚胺树脂及其制备方法 | |
| JPH0577196B2 (enrdf_load_html_response) | ||
| DE2355858C3 (de) | Formbare Zusammensetzung auf der Basis von wärmehärtbarem Harz | |
| JPS62286298A (ja) | プラスチツク成形プリント配線板の製造法 | |
| CN116425977B (zh) | 低温固化邻苯二甲腈型双马来酰亚胺-三嗪树脂的制备方法 | |
| CN111154232A (zh) | 一种环氧树脂耐磨复合材料的制备方法 | |
| TWI747202B (zh) | 精密立體電路零件的製造方法 | |
| CN103787665B (zh) | 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 | |
| JPS63162212A (ja) | プラスチツク成形プリント配線板の製造法． | |
| CN104910353B (zh) | 一种以聚硼氮硅烷为固化剂的耐高温环氧树脂的制备方法 | |
| JP4224907B2 (ja) | シート状エポキシ樹脂組成物の製造方法 | |
| JPS63148698A (ja) | プラスチツク成形プリント配線板の製造法 | |
| JPS63307908A (ja) | 樹脂型の製造法 | |
| JPH05295083A (ja) | 型用エポキシ樹脂組成物及びそれから得られる樹脂型 | |
| CN107498967A (zh) | 一种易加工保温复合材料及其制备方法 | |
| JP2849590B2 (ja) | 金属表層セメント製品の製造方法 | |
| JPS5839040A (ja) | エポキシ樹脂封止用成形材料 |