JPS62163388A - プラスチツク成形プリント配線板の製造法 - Google Patents
プラスチツク成形プリント配線板の製造法Info
- Publication number
- JPS62163388A JPS62163388A JP421286A JP421286A JPS62163388A JP S62163388 A JPS62163388 A JP S62163388A JP 421286 A JP421286 A JP 421286A JP 421286 A JP421286 A JP 421286A JP S62163388 A JPS62163388 A JP S62163388A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- printed wiring
- mold
- wiring board
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP421286A JPS62163388A (ja) | 1986-01-14 | 1986-01-14 | プラスチツク成形プリント配線板の製造法 |
| DE19863613006 DE3613006A1 (de) | 1985-04-17 | 1986-04-17 | Starre harzform |
| DE19873700902 DE3700902A1 (de) | 1986-01-14 | 1987-01-14 | Verfahren zur herstellung von plastikgeformten, gedruckten schaltplatten |
| US07/003,344 US4764327A (en) | 1986-01-14 | 1987-01-14 | Process of producing plastic-molded printed circuit boards |
| US07/029,581 US4740343A (en) | 1985-04-17 | 1987-03-25 | Method for producing rigid resin molds |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP421286A JPS62163388A (ja) | 1986-01-14 | 1986-01-14 | プラスチツク成形プリント配線板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62163388A true JPS62163388A (ja) | 1987-07-20 |
| JPH0577196B2 JPH0577196B2 (enrdf_load_html_response) | 1993-10-26 |
Family
ID=11578316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP421286A Granted JPS62163388A (ja) | 1985-04-17 | 1986-01-14 | プラスチツク成形プリント配線板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163388A (enrdf_load_html_response) |
-
1986
- 1986-01-14 JP JP421286A patent/JPS62163388A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0577196B2 (enrdf_load_html_response) | 1993-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4740343A (en) | Method for producing rigid resin molds | |
| CN109265922B (zh) | 一种高韧性自催化环氧树脂及制备方法 | |
| CN103146141A (zh) | 一种低介电系数poss/环氧树脂杂化材料及制备方法 | |
| CN110396210A (zh) | 一种低介电高玻璃化转变温度聚芳醚腈树脂的制备方法 | |
| US4764327A (en) | Process of producing plastic-molded printed circuit boards | |
| TWI647797B (zh) | Sealing material with semiconductor sealing substrate, semiconductor device, and method of manufacturing semiconductor device | |
| TW484347B (en) | Wiring substrate material and the substrate material for the printed circuit using the same | |
| JPS62163388A (ja) | プラスチツク成形プリント配線板の製造法 | |
| CN101068851A (zh) | 聚酰亚胺、聚酰亚胺膜和层压体 | |
| CN116425977B (zh) | 低温固化邻苯二甲腈型双马来酰亚胺-三嗪树脂的制备方法 | |
| JPS62286298A (ja) | プラスチツク成形プリント配線板の製造法 | |
| CN108997577A (zh) | 一种氨基封端含二氮杂萘酮联苯结构聚芳醚固化剂制备邻苯二甲腈树脂固化物的方法 | |
| CN103787665B (zh) | 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 | |
| JP2892433B2 (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP4224907B2 (ja) | シート状エポキシ樹脂組成物の製造方法 | |
| JP3705618B2 (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| CN104910353B (zh) | 一种以聚硼氮硅烷为固化剂的耐高温环氧树脂的制备方法 | |
| JPH10310629A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPH05295083A (ja) | 型用エポキシ樹脂組成物及びそれから得られる樹脂型 | |
| JPH0774263B2 (ja) | エポキシ樹脂組成物 | |
| JPH0245519A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP2000136291A (ja) | 封止用樹脂組成物及び半導体封止装置 | |
| JPS63162212A (ja) | プラスチツク成形プリント配線板の製造法． | |
| CN107498967A (zh) | 一种易加工保温复合材料及其制备方法 | |
| CN114854176A (zh) | 一种航空用高Tg温度环氧树脂及其生产工艺 |