JPH0577180B2 - - Google Patents
Info
- Publication number
- JPH0577180B2 JPH0577180B2 JP60082309A JP8230985A JPH0577180B2 JP H0577180 B2 JPH0577180 B2 JP H0577180B2 JP 60082309 A JP60082309 A JP 60082309A JP 8230985 A JP8230985 A JP 8230985A JP H0577180 B2 JPH0577180 B2 JP H0577180B2
- Authority
- JP
- Japan
- Prior art keywords
- gripped
- shape memory
- gripping
- memory alloy
- bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 44
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 238000011084 recovery Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Automatic Assembly (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8230985A JPS61241940A (ja) | 1985-04-19 | 1985-04-19 | 把持装置 |
US06/853,450 US4715637A (en) | 1985-04-17 | 1986-04-17 | Grip device for sheet-like objects |
DE8686105342T DE3685835T2 (de) | 1985-04-17 | 1986-04-17 | Greiferwerkzeug. |
EP86105342A EP0198501B1 (en) | 1985-04-17 | 1986-04-17 | Gripping device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8230985A JPS61241940A (ja) | 1985-04-19 | 1985-04-19 | 把持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61241940A JPS61241940A (ja) | 1986-10-28 |
JPH0577180B2 true JPH0577180B2 (ru) | 1993-10-26 |
Family
ID=13770953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8230985A Granted JPS61241940A (ja) | 1985-04-17 | 1985-04-19 | 把持装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61241940A (ru) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6474712B1 (en) * | 1999-05-15 | 2002-11-05 | Applied Materials, Inc. | Gripper for supporting substrate in a vertical orientation |
FR2932272B1 (fr) * | 2008-06-09 | 2011-02-25 | Stago Diagnostica | Dispositif de prehension d'une cuvette de reaction |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59695A (ja) * | 1982-06-26 | 1984-01-05 | 原子燃料工業株式会社 | 異物回収装置 |
JPS591583B2 (ja) * | 1979-10-05 | 1984-01-12 | 河西工業株式会社 | 自動車用内装部品の製造方法 |
JPS6044270A (ja) * | 1983-08-15 | 1985-03-09 | セイコーエプソン株式会社 | 半導体装置製造用の円形基板の取扱い治具 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS568185Y2 (ru) * | 1975-12-10 | 1981-02-23 | ||
JPS591583U (ja) * | 1982-06-28 | 1984-01-07 | オムロン株式会社 | 産業用ロボツト腕 |
JPS59156763U (ja) * | 1983-04-06 | 1984-10-20 | 三洋電機株式会社 | 半導体装置用ピンセツト |
-
1985
- 1985-04-19 JP JP8230985A patent/JPS61241940A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS591583B2 (ja) * | 1979-10-05 | 1984-01-12 | 河西工業株式会社 | 自動車用内装部品の製造方法 |
JPS59695A (ja) * | 1982-06-26 | 1984-01-05 | 原子燃料工業株式会社 | 異物回収装置 |
JPS6044270A (ja) * | 1983-08-15 | 1985-03-09 | セイコーエプソン株式会社 | 半導体装置製造用の円形基板の取扱い治具 |
Also Published As
Publication number | Publication date |
---|---|
JPS61241940A (ja) | 1986-10-28 |
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