JPH0572103B2 - - Google Patents

Info

Publication number
JPH0572103B2
JPH0572103B2 JP63031594A JP3159488A JPH0572103B2 JP H0572103 B2 JPH0572103 B2 JP H0572103B2 JP 63031594 A JP63031594 A JP 63031594A JP 3159488 A JP3159488 A JP 3159488A JP H0572103 B2 JPH0572103 B2 JP H0572103B2
Authority
JP
Japan
Prior art keywords
axis
axis direction
frame
moved
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63031594A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01206637A (ja
Inventor
Yasunobu Suzuki
Akihiro Nishimura
Kimiharu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP3159488A priority Critical patent/JPH01206637A/ja
Publication of JPH01206637A publication Critical patent/JPH01206637A/ja
Publication of JPH0572103B2 publication Critical patent/JPH0572103B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
JP3159488A 1988-02-13 1988-02-13 Ｘｙ駆動機構 Granted JPH01206637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3159488A JPH01206637A (ja) 1988-02-13 1988-02-13 Ｘｙ駆動機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3159488A JPH01206637A (ja) 1988-02-13 1988-02-13 Ｘｙ駆動機構

Publications (2)

Publication Number Publication Date
JPH01206637A JPH01206637A (ja) 1989-08-18
JPH0572103B2 true JPH0572103B2 (enExample) 1993-10-08

Family

ID=12335520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3159488A Granted JPH01206637A (ja) 1988-02-13 1988-02-13 Ｘｙ駆動機構

Country Status (1)

Country Link
JP (1) JPH01206637A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173264A (ja) * 2005-12-19 2007-07-05 Tanaka Seiki Kk 多軸巻線機

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141A (ja) * 1981-06-25 1983-01-05 Shinkawa Ltd 自動インナ−リ−ドボンデイング方法
JPS58120448A (ja) * 1981-12-29 1983-07-18 Fanuc Ltd 工作機械のテ−ブル制御方式

Also Published As

Publication number Publication date
JPH01206637A (ja) 1989-08-18

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