JPH0570954B2 - - Google Patents
Info
- Publication number
- JPH0570954B2 JPH0570954B2 JP3416384A JP3416384A JPH0570954B2 JP H0570954 B2 JPH0570954 B2 JP H0570954B2 JP 3416384 A JP3416384 A JP 3416384A JP 3416384 A JP3416384 A JP 3416384A JP H0570954 B2 JPH0570954 B2 JP H0570954B2
- Authority
- JP
- Japan
- Prior art keywords
- aln
- circuit board
- thermal conductivity
- paste
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 21
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- 239000005751 Copper oxide Substances 0.000 claims description 8
- 229910000431 copper oxide Inorganic materials 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229910018565 CuAl Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 and on top of that Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3416384A JPS60178687A (ja) | 1984-02-27 | 1984-02-27 | 高熱伝導性回路基板 |
| US06/706,280 US4659611A (en) | 1984-02-27 | 1985-02-27 | Circuit substrate having high thermal conductivity |
| EP85102159A EP0153737B1 (en) | 1984-02-27 | 1985-02-27 | Circuit substrate having high thermal conductivity |
| DE85102159T DE3587481T2 (de) | 1984-02-27 | 1985-02-27 | Schaltungssubstrat mit hoher Wärmeleitfähigkeit. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3416384A JPS60178687A (ja) | 1984-02-27 | 1984-02-27 | 高熱伝導性回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60178687A JPS60178687A (ja) | 1985-09-12 |
| JPH0570954B2 true JPH0570954B2 (enrdf_load_stackoverflow) | 1993-10-06 |
Family
ID=12406537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3416384A Granted JPS60178687A (ja) | 1984-02-27 | 1984-02-27 | 高熱伝導性回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60178687A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107573071A (zh) * | 2017-09-28 | 2018-01-12 | 东北大学 | 一种单分散球形Y2O3和Al2O3粉制备(Y1‑xYbx)AG透明陶瓷的方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6135555A (ja) * | 1984-07-27 | 1986-02-20 | Nec Corp | 厚膜混成集積回路装置 |
| JPS6284595A (ja) * | 1985-10-08 | 1987-04-18 | 日本電気株式会社 | 多層セラミック配線基板 |
| JPH0680747B2 (ja) * | 1986-03-31 | 1994-10-12 | イビデン株式会社 | 窒化アルミニウム質焼結体よりなる配線基板とその製造方法 |
| JPS63291303A (ja) * | 1987-05-22 | 1988-11-29 | Matsushita Electric Ind Co Ltd | メタライズ組成物 |
| JPS63291304A (ja) * | 1987-05-22 | 1988-11-29 | Matsushita Electric Ind Co Ltd | メタライズ組成物 |
| JPH0638553B2 (ja) * | 1987-10-29 | 1994-05-18 | イビデン株式会社 | 窒化アルミニウム質多層基板 |
| JP2765885B2 (ja) * | 1988-11-14 | 1998-06-18 | 新光電気工業株式会社 | 窒化アルミニウム回路基板及びその製造方法 |
-
1984
- 1984-02-27 JP JP3416384A patent/JPS60178687A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107573071A (zh) * | 2017-09-28 | 2018-01-12 | 东北大学 | 一种单分散球形Y2O3和Al2O3粉制备(Y1‑xYbx)AG透明陶瓷的方法 |
| CN107573071B (zh) * | 2017-09-28 | 2020-05-12 | 东北大学 | 一种单分散球形Y2O3和Al2O3粉制备(Y1-xYbx)AG透明陶瓷的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60178687A (ja) | 1985-09-12 |
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