JPH0570581B2 - - Google Patents

Info

Publication number
JPH0570581B2
JPH0570581B2 JP60104392A JP10439285A JPH0570581B2 JP H0570581 B2 JPH0570581 B2 JP H0570581B2 JP 60104392 A JP60104392 A JP 60104392A JP 10439285 A JP10439285 A JP 10439285A JP H0570581 B2 JPH0570581 B2 JP H0570581B2
Authority
JP
Japan
Prior art keywords
resin
nonwoven fabric
aromatic polyamide
phosphate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60104392A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61262120A (ja
Inventor
Masaaki Nakamura
Tomohiko Nakao
Keiichi Uno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP10439285A priority Critical patent/JPS61262120A/ja
Publication of JPS61262120A publication Critical patent/JPS61262120A/ja
Publication of JPH0570581B2 publication Critical patent/JPH0570581B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10439285A 1985-05-16 1985-05-16 芳香族ポリアミド不織布補強樹脂シ−ト Granted JPS61262120A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10439285A JPS61262120A (ja) 1985-05-16 1985-05-16 芳香族ポリアミド不織布補強樹脂シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10439285A JPS61262120A (ja) 1985-05-16 1985-05-16 芳香族ポリアミド不織布補強樹脂シ−ト

Publications (2)

Publication Number Publication Date
JPS61262120A JPS61262120A (ja) 1986-11-20
JPH0570581B2 true JPH0570581B2 (enrdf_load_stackoverflow) 1993-10-05

Family

ID=14379462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10439285A Granted JPS61262120A (ja) 1985-05-16 1985-05-16 芳香族ポリアミド不織布補強樹脂シ−ト

Country Status (1)

Country Link
JP (1) JPS61262120A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186744A (ja) * 1987-01-28 1988-08-02 Showa Highpolymer Co Ltd 光硬化性繊維強化プラスチックプリプレグシート積層体
JPH0939170A (ja) * 1995-07-28 1997-02-10 Teijin Ltd 難燃性成型用布帛
JPH10338809A (ja) * 1997-04-08 1998-12-22 Sumitomo Chem Co Ltd 低誘電率樹脂とパラ配向芳香族ポリアミドとからなる複合フィルム、そのプリプレグおよびそれらの用途
JP4016123B2 (ja) * 2002-07-22 2007-12-05 平岡織染株式会社 難燃化ポリプロピレン系樹脂膜材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149560A (en) * 1975-06-17 1976-12-22 Sumitomo Electric Industries Method of manufacturing flexible printed circuit
JPS58128847A (ja) * 1982-01-27 1983-08-01 日立化成工業株式会社 エポキシ樹脂銅張積層板

Also Published As

Publication number Publication date
JPS61262120A (ja) 1986-11-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees