JPH0570305B2 - - Google Patents
Info
- Publication number
- JPH0570305B2 JPH0570305B2 JP62115212A JP11521287A JPH0570305B2 JP H0570305 B2 JPH0570305 B2 JP H0570305B2 JP 62115212 A JP62115212 A JP 62115212A JP 11521287 A JP11521287 A JP 11521287A JP H0570305 B2 JPH0570305 B2 JP H0570305B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- insulating sheet
- resin
- present
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11521287A JPS63278356A (ja) | 1987-05-11 | 1987-05-11 | 半導体集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11521287A JPS63278356A (ja) | 1987-05-11 | 1987-05-11 | 半導体集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63278356A JPS63278356A (ja) | 1988-11-16 |
| JPH0570305B2 true JPH0570305B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-04 |
Family
ID=14657140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11521287A Granted JPS63278356A (ja) | 1987-05-11 | 1987-05-11 | 半導体集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63278356A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109256A (ja) * | 1983-11-18 | 1985-06-14 | Oki Electric Ind Co Ltd | プラスチツク型半導体装置 |
-
1987
- 1987-05-11 JP JP11521287A patent/JPS63278356A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63278356A (ja) | 1988-11-16 |