JPH0567058B2 - - Google Patents

Info

Publication number
JPH0567058B2
JPH0567058B2 JP13396687A JP13396687A JPH0567058B2 JP H0567058 B2 JPH0567058 B2 JP H0567058B2 JP 13396687 A JP13396687 A JP 13396687A JP 13396687 A JP13396687 A JP 13396687A JP H0567058 B2 JPH0567058 B2 JP H0567058B2
Authority
JP
Japan
Prior art keywords
chip
wiring board
rubber
resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13396687A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63299242A (ja
Inventor
Takumi Suda
Akio Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP13396687A priority Critical patent/JPS63299242A/ja
Publication of JPS63299242A publication Critical patent/JPS63299242A/ja
Publication of JPH0567058B2 publication Critical patent/JPH0567058B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
JP13396687A 1987-05-29 1987-05-29 半導体装置の接続方法 Granted JPS63299242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13396687A JPS63299242A (ja) 1987-05-29 1987-05-29 半導体装置の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13396687A JPS63299242A (ja) 1987-05-29 1987-05-29 半導体装置の接続方法

Publications (2)

Publication Number Publication Date
JPS63299242A JPS63299242A (ja) 1988-12-06
JPH0567058B2 true JPH0567058B2 (enrdf_load_stackoverflow) 1993-09-24

Family

ID=15117245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13396687A Granted JPS63299242A (ja) 1987-05-29 1987-05-29 半導体装置の接続方法

Country Status (1)

Country Link
JP (1) JPS63299242A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666355B2 (ja) * 1988-12-16 1994-08-24 松下電器産業株式会社 半導体装置の実装体およびその実装方法
JPH02185050A (ja) * 1989-01-12 1990-07-19 Matsushita Electric Ind Co Ltd 半導体装置の実装方法
JP5340318B2 (ja) * 2009-02-04 2013-11-13 信越ポリマー株式会社 静電容量型入力スイッチ

Also Published As

Publication number Publication date
JPS63299242A (ja) 1988-12-06

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