JPH056688Y2 - - Google Patents
Info
- Publication number
- JPH056688Y2 JPH056688Y2 JP3560786U JP3560786U JPH056688Y2 JP H056688 Y2 JPH056688 Y2 JP H056688Y2 JP 3560786 U JP3560786 U JP 3560786U JP 3560786 U JP3560786 U JP 3560786U JP H056688 Y2 JPH056688 Y2 JP H056688Y2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- layer
- thick film
- solder
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3560786U JPH056688Y2 (ko) | 1986-03-11 | 1986-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3560786U JPH056688Y2 (ko) | 1986-03-11 | 1986-03-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62147380U JPS62147380U (ko) | 1987-09-17 |
| JPH056688Y2 true JPH056688Y2 (ko) | 1993-02-19 |
Family
ID=30845256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3560786U Expired - Lifetime JPH056688Y2 (ko) | 1986-03-11 | 1986-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056688Y2 (ko) |
-
1986
- 1986-03-11 JP JP3560786U patent/JPH056688Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62147380U (ko) | 1987-09-17 |
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