JPH056660Y2 - - Google Patents
Info
- Publication number
- JPH056660Y2 JPH056660Y2 JP1986195655U JP19565586U JPH056660Y2 JP H056660 Y2 JPH056660 Y2 JP H056660Y2 JP 1986195655 U JP1986195655 U JP 1986195655U JP 19565586 U JP19565586 U JP 19565586U JP H056660 Y2 JPH056660 Y2 JP H056660Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead
- tip
- gigantic
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986195655U JPH056660Y2 (da) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986195655U JPH056660Y2 (da) | 1986-12-19 | 1986-12-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63100834U JPS63100834U (da) | 1988-06-30 |
JPH056660Y2 true JPH056660Y2 (da) | 1993-02-19 |
Family
ID=31153738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986195655U Expired - Lifetime JPH056660Y2 (da) | 1986-12-19 | 1986-12-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH056660Y2 (da) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02205334A (ja) * | 1989-02-03 | 1990-08-15 | Orient Watch Co Ltd | 半導体装置の製造方法 |
-
1986
- 1986-12-19 JP JP1986195655U patent/JPH056660Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63100834U (da) | 1988-06-30 |
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