JPH0564855B2 - - Google Patents
Info
- Publication number
- JPH0564855B2 JPH0564855B2 JP4943585A JP4943585A JPH0564855B2 JP H0564855 B2 JPH0564855 B2 JP H0564855B2 JP 4943585 A JP4943585 A JP 4943585A JP 4943585 A JP4943585 A JP 4943585A JP H0564855 B2 JPH0564855 B2 JP H0564855B2
- Authority
- JP
- Japan
- Prior art keywords
- finger
- lead frame
- resist
- electroforming
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4943585A JPS61208860A (ja) | 1985-03-14 | 1985-03-14 | 半導体装置におけるリードフレーム製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4943585A JPS61208860A (ja) | 1985-03-14 | 1985-03-14 | 半導体装置におけるリードフレーム製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61208860A JPS61208860A (ja) | 1986-09-17 |
| JPH0564855B2 true JPH0564855B2 (enrdf_load_stackoverflow) | 1993-09-16 |
Family
ID=12831026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4943585A Granted JPS61208860A (ja) | 1985-03-14 | 1985-03-14 | 半導体装置におけるリードフレーム製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61208860A (enrdf_load_stackoverflow) |
-
1985
- 1985-03-14 JP JP4943585A patent/JPS61208860A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61208860A (ja) | 1986-09-17 |
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