JPH0564854B2 - - Google Patents

Info

Publication number
JPH0564854B2
JPH0564854B2 JP60049433A JP4943385A JPH0564854B2 JP H0564854 B2 JPH0564854 B2 JP H0564854B2 JP 60049433 A JP60049433 A JP 60049433A JP 4943385 A JP4943385 A JP 4943385A JP H0564854 B2 JPH0564854 B2 JP H0564854B2
Authority
JP
Japan
Prior art keywords
lead frame
finger
semiconductor chip
fingers
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60049433A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61208858A (ja
Inventor
Hiroshi Shimazu
Yasuo Yamashita
Masayoshi Suzuki
Eiji Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP4943385A priority Critical patent/JPS61208858A/ja
Publication of JPS61208858A publication Critical patent/JPS61208858A/ja
Publication of JPH0564854B2 publication Critical patent/JPH0564854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4943385A 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法 Granted JPS61208858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4943385A JPS61208858A (ja) 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4943385A JPS61208858A (ja) 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4089836A Division JP2528765B2 (ja) 1992-03-14 1992-03-14 半導体装置のリ―ドフレ―ム

Publications (2)

Publication Number Publication Date
JPS61208858A JPS61208858A (ja) 1986-09-17
JPH0564854B2 true JPH0564854B2 (enrdf_load_stackoverflow) 1993-09-16

Family

ID=12830969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4943385A Granted JPS61208858A (ja) 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法

Country Status (1)

Country Link
JP (1) JPS61208858A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2534251B2 (ja) * 1987-02-20 1996-09-11 日東電工株式会社 半導体装置

Also Published As

Publication number Publication date
JPS61208858A (ja) 1986-09-17

Similar Documents

Publication Publication Date Title
KR100437437B1 (ko) 반도체 패키지의 제조법 및 반도체 패키지
US5126818A (en) Semiconductor device
US5322204A (en) Electronic substrate multiple location conductor attachment technology
US5311056A (en) Semiconductor device having a bi-level leadframe
JPH0564854B2 (enrdf_load_stackoverflow)
US5229328A (en) Method for bonding dielectric mounted conductors to semiconductor chip contact pads
US5233221A (en) Electronic substrate multiple location conductor attachment technology
JPH02276259A (ja) 回路基板構造
EP0204102A2 (en) Direct connection of lead frame having flexible, tapered leads and mechanical die support
JP2549277B2 (ja) 半導体装置
JPH0738400B2 (ja) 半導体装置
JPS61234060A (ja) 半導体装置のリ−ドフレ−ム製造方法
JPS61208859A (ja) 半導体装置のリ−ドフレ−ム
JP2528765B2 (ja) 半導体装置のリ―ドフレ―ム
JPH0564853B2 (enrdf_load_stackoverflow)
JP2000058701A (ja) 補強部付キャリアテープおよびこれを用いた半導体装置
JP2524645B2 (ja) リ―ドフレ―ムおよびその製造方法
JPS61234061A (ja) 半導体装置のリ−ドフレ−ム製造方法
JP3858396B2 (ja) 半導体装置の製造方法
JPH0766954B2 (ja) 半導体装置
JP2528766B2 (ja) 半導体装置
JPH0564855B2 (enrdf_load_stackoverflow)
JPH07112037B2 (ja) 半導体装置の製造中間体ならびにその製造方法
JPH07105601B2 (ja) 多層プリント配線板の製造方法
KR100708033B1 (ko) 반도체 패키지용 섭스트레이트 및 이의 제조방법