JPS61208858A - 半導体装置のリ−ドフレ−ム製造方法 - Google Patents

半導体装置のリ−ドフレ−ム製造方法

Info

Publication number
JPS61208858A
JPS61208858A JP4943385A JP4943385A JPS61208858A JP S61208858 A JPS61208858 A JP S61208858A JP 4943385 A JP4943385 A JP 4943385A JP 4943385 A JP4943385 A JP 4943385A JP S61208858 A JPS61208858 A JP S61208858A
Authority
JP
Japan
Prior art keywords
finger
lead frame
bump
semiconductor chip
condition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4943385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564854B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Shimazu
博士 嶋津
Yasuo Yamashita
康夫 山下
Masayoshi Suzuki
鈴記　正義
Eiji Sakata
栄二 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Kyushu Hitachi Maxell Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu Hitachi Maxell Ltd, Hitachi Maxell Ltd filed Critical Kyushu Hitachi Maxell Ltd
Priority to JP4943385A priority Critical patent/JPS61208858A/ja
Publication of JPS61208858A publication Critical patent/JPS61208858A/ja
Publication of JPH0564854B2 publication Critical patent/JPH0564854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4943385A 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法 Granted JPS61208858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4943385A JPS61208858A (ja) 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4943385A JPS61208858A (ja) 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4089836A Division JP2528765B2 (ja) 1992-03-14 1992-03-14 半導体装置のリ―ドフレ―ム

Publications (2)

Publication Number Publication Date
JPS61208858A true JPS61208858A (ja) 1986-09-17
JPH0564854B2 JPH0564854B2 (enrdf_load_stackoverflow) 1993-09-16

Family

ID=12830969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4943385A Granted JPS61208858A (ja) 1985-03-14 1985-03-14 半導体装置のリ−ドフレ−ム製造方法

Country Status (1)

Country Link
JP (1) JPS61208858A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63204753A (ja) * 1987-02-20 1988-08-24 Nitto Electric Ind Co Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63204753A (ja) * 1987-02-20 1988-08-24 Nitto Electric Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0564854B2 (enrdf_load_stackoverflow) 1993-09-16

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