JPH0564853B2 - - Google Patents

Info

Publication number
JPH0564853B2
JPH0564853B2 JP60048231A JP4823185A JPH0564853B2 JP H0564853 B2 JPH0564853 B2 JP H0564853B2 JP 60048231 A JP60048231 A JP 60048231A JP 4823185 A JP4823185 A JP 4823185A JP H0564853 B2 JPH0564853 B2 JP H0564853B2
Authority
JP
Japan
Prior art keywords
lead frame
base material
tab
electroforming
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60048231A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61208245A (ja
Inventor
Hiroshi Shimazu
Yasuo Yamashita
Masayoshi Suzuki
Eiji Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP60048231A priority Critical patent/JPS61208245A/ja
Publication of JPS61208245A publication Critical patent/JPS61208245A/ja
Publication of JPH0564853B2 publication Critical patent/JPH0564853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/05—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60048231A 1985-03-13 1985-03-13 半導体装置のリ−ドフレ−ム製造方法 Granted JPS61208245A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60048231A JPS61208245A (ja) 1985-03-13 1985-03-13 半導体装置のリ−ドフレ−ム製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60048231A JPS61208245A (ja) 1985-03-13 1985-03-13 半導体装置のリ−ドフレ−ム製造方法

Publications (2)

Publication Number Publication Date
JPS61208245A JPS61208245A (ja) 1986-09-16
JPH0564853B2 true JPH0564853B2 (cg-RX-API-DMAC10.html) 1993-09-16

Family

ID=12797663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60048231A Granted JPS61208245A (ja) 1985-03-13 1985-03-13 半導体装置のリ−ドフレ−ム製造方法

Country Status (1)

Country Link
JP (1) JPS61208245A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5556810A (en) * 1990-06-01 1996-09-17 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating
JP2540652B2 (ja) * 1990-06-01 1996-10-09 株式会社東芝 半導体装置
KR20040064191A (ko) * 2003-01-09 2004-07-16 김정식 적층박막전주가공물과 그 제작방법.

Also Published As

Publication number Publication date
JPS61208245A (ja) 1986-09-16

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