JPH0564859B2 - - Google Patents

Info

Publication number
JPH0564859B2
JPH0564859B2 JP60074301A JP7430185A JPH0564859B2 JP H0564859 B2 JPH0564859 B2 JP H0564859B2 JP 60074301 A JP60074301 A JP 60074301A JP 7430185 A JP7430185 A JP 7430185A JP H0564859 B2 JPH0564859 B2 JP H0564859B2
Authority
JP
Japan
Prior art keywords
tab
lead
resist
lead frame
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60074301A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61234062A (ja
Inventor
Hiroshi Shimazu
Yasuo Yamashita
Masayoshi Suzuki
Eiji Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP60074301A priority Critical patent/JPS61234062A/ja
Publication of JPS61234062A publication Critical patent/JPS61234062A/ja
Publication of JPH0564859B2 publication Critical patent/JPH0564859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/04

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP60074301A 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法 Granted JPS61234062A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60074301A JPS61234062A (ja) 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60074301A JPS61234062A (ja) 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法

Publications (2)

Publication Number Publication Date
JPS61234062A JPS61234062A (ja) 1986-10-18
JPH0564859B2 true JPH0564859B2 (cg-RX-API-DMAC10.html) 1993-09-16

Family

ID=13543169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60074301A Granted JPS61234062A (ja) 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法

Country Status (1)

Country Link
JP (1) JPS61234062A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2521417B2 (ja) * 1994-08-22 1996-08-07 九州日立マクセル株式会社 電鋳方法

Also Published As

Publication number Publication date
JPS61234062A (ja) 1986-10-18

Similar Documents

Publication Publication Date Title
US4049903A (en) Circuit film strip and manufacturing method
US5859471A (en) Semiconductor device having tab tape lead frame with reinforced outer leads
US3968563A (en) Precision registration system for leads
US4343083A (en) Method of manufacturing flexible printed circuit sheets
US5032542A (en) Method of mass-producing integrated circuit devices using strip lead frame
EP0999587B1 (en) Production of semiconductor device
JP2003264359A (ja) 立体回路基体の製造方法
JPH0564859B2 (cg-RX-API-DMAC10.html)
US5118556A (en) Film material for film carrier manufacture and a method for manufacturing film carrier
JP2668375B2 (ja) 回路部品の電極製造方法
JPH08139220A (ja) リードレスチップキャリア及びその製造方法
JPH0564853B2 (cg-RX-API-DMAC10.html)
JPH0332268B2 (cg-RX-API-DMAC10.html)
JPS5921174B2 (ja) キヤリヤテ−プの製造方法
JP3028286B2 (ja) Smdパレット一体型fpc及びその製造方法
JPS61234060A (ja) 半導体装置のリ−ドフレ−ム製造方法
JPS61234061A (ja) 半導体装置のリ−ドフレ−ム製造方法
JPH0529395A (ja) Tabテープの製造方法
JP2509882B2 (ja) 半導体装置の製造方法
JPS62188345A (ja) 混成集積回路の製造方法
JPS61265852A (ja) キヤリア・テ−プ
JP2505827B2 (ja) フィルムキャリアの製造方法
JPH0671058B2 (ja) 微少点状めっき部を有するリ−ドフレ−ムの製造方法
JP2528765B2 (ja) 半導体装置のリ―ドフレ―ム
JPS6352469B2 (cg-RX-API-DMAC10.html)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees