JPH0564457B2 - - Google Patents
Info
- Publication number
- JPH0564457B2 JPH0564457B2 JP59084028A JP8402884A JPH0564457B2 JP H0564457 B2 JPH0564457 B2 JP H0564457B2 JP 59084028 A JP59084028 A JP 59084028A JP 8402884 A JP8402884 A JP 8402884A JP H0564457 B2 JPH0564457 B2 JP H0564457B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- polycrystalline silicon
- semiconductor
- semiconductor region
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/30—Devices controlled by electric currents or voltages
- H10D48/32—Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H10D48/34—Bipolar devices
- H10D48/345—Bipolar transistors having ohmic electrodes on emitter-like, base-like, and collector-like regions
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Bipolar Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59084028A JPS60229370A (ja) | 1984-04-27 | 1984-04-27 | 自己整合型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59084028A JPS60229370A (ja) | 1984-04-27 | 1984-04-27 | 自己整合型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60229370A JPS60229370A (ja) | 1985-11-14 |
| JPH0564457B2 true JPH0564457B2 (cg-RX-API-DMAC7.html) | 1993-09-14 |
Family
ID=13819087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59084028A Granted JPS60229370A (ja) | 1984-04-27 | 1984-04-27 | 自己整合型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60229370A (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4803175A (en) * | 1987-09-14 | 1989-02-07 | Motorola Inc. | Method of fabricating a bipolar semiconductor device with silicide contacts |
-
1984
- 1984-04-27 JP JP59084028A patent/JPS60229370A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60229370A (ja) | 1985-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6318673A (ja) | 半導体装置の製法 | |
| US4465528A (en) | Method of producing a walled emitter semiconductor device | |
| JP3923620B2 (ja) | 半導体基板の製造方法 | |
| JPH0564457B2 (cg-RX-API-DMAC7.html) | ||
| JP2538077B2 (ja) | 半導体装置の製造方法 | |
| JPH0239091B2 (cg-RX-API-DMAC7.html) | ||
| JPH0529330A (ja) | 半導体装置の製造方法 | |
| JPS6220711B2 (cg-RX-API-DMAC7.html) | ||
| JPH0313745B2 (cg-RX-API-DMAC7.html) | ||
| JP2707646B2 (ja) | 半導体装置の製造方法 | |
| JPS63182860A (ja) | 半導体装置とその製造方法 | |
| JPH0618185B2 (ja) | 半導体装置における微細孔の形成方法および半導体装置の製造方法 | |
| JPH0576769B2 (cg-RX-API-DMAC7.html) | ||
| JPH0475346A (ja) | 半導体装置の製造方法 | |
| JPH04260331A (ja) | 半導体装置の製造方法 | |
| JPH02148847A (ja) | 半導体装置の製造方法 | |
| JPS59154026A (ja) | 微細な穴の形成方法 | |
| JPH11233521A (ja) | 半導体装置の製造方法 | |
| JPS6161546B2 (cg-RX-API-DMAC7.html) | ||
| JPS6386476A (ja) | 半導体集積回路装置の製造方法 | |
| JPH0550856B2 (cg-RX-API-DMAC7.html) | ||
| JPH01181465A (ja) | 超高速半導体装置の製造方法 | |
| JPS5871654A (ja) | 半導体装置の製造方法 | |
| JPS6097626A (ja) | 半導体装置における微細孔の形成方法および半導体装置の製造方法 | |
| JPS5918674A (ja) | 半導体装置の製造方法 |