JPH0562823B2 - - Google Patents
Info
- Publication number
- JPH0562823B2 JPH0562823B2 JP29886085A JP29886085A JPH0562823B2 JP H0562823 B2 JPH0562823 B2 JP H0562823B2 JP 29886085 A JP29886085 A JP 29886085A JP 29886085 A JP29886085 A JP 29886085A JP H0562823 B2 JPH0562823 B2 JP H0562823B2
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- film wiring
- active layer
- plating
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60298860A JPS62156838A (ja) | 1985-12-27 | 1985-12-27 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60298860A JPS62156838A (ja) | 1985-12-27 | 1985-12-27 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62156838A JPS62156838A (ja) | 1987-07-11 |
JPH0562823B2 true JPH0562823B2 (enrdf_load_html_response) | 1993-09-09 |
Family
ID=17865127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60298860A Granted JPS62156838A (ja) | 1985-12-27 | 1985-12-27 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62156838A (enrdf_load_html_response) |
-
1985
- 1985-12-27 JP JP60298860A patent/JPS62156838A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62156838A (ja) | 1987-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5045503A (en) | Microwave monolithic integrated circuit with heat radiating electrode | |
US3354360A (en) | Integrated circuits with active elements isolated by insulating material | |
US3357871A (en) | Method for fabricating integrated circuits | |
JPH05102200A (ja) | 半導体装置 | |
JPH0640591B2 (ja) | モノリシツク半導体構造とその製法 | |
US3698941A (en) | Method of applying contacts to a semiconductor body | |
US4596069A (en) | Three dimensional processing for monolithic IMPATTs | |
US4692791A (en) | Monolithic IMPATT with stripline leads | |
JPH0562823B2 (enrdf_load_html_response) | ||
US4095330A (en) | Composite semiconductor integrated circuit and method of manufacture | |
KR940002769B1 (ko) | 오버래핑하는 도전층을 갖는 반도체 장치와 그 제조방법 | |
JP2713113B2 (ja) | 半導体装置の製造方法 | |
GB2278017A (en) | Semiconductor integrated circuit device | |
JPH0510827B2 (enrdf_load_html_response) | ||
US6074948A (en) | Method for manufacturing thin semiconductor device | |
JPS62211962A (ja) | 高周波半導体装置の製造方法 | |
JPH0777265B2 (ja) | 半導体装置の製造方法 | |
JPS61268060A (ja) | 半導体装置の製造方法 | |
JP2792421B2 (ja) | 半導体装置の製造方法 | |
JP2576462B2 (ja) | 半導体装置の製造方法 | |
JPH0290623A (ja) | 半導体装置の製造方法 | |
JPS5851433B2 (ja) | 横形電界効果トランジスタの製造方法 | |
JPS62186569A (ja) | 電界効果型トランジスタの製造方法 | |
JPH11150113A (ja) | 半導体装置の製造方法 | |
JPS63204663A (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |