JPH0562591B2 - - Google Patents
Info
- Publication number
- JPH0562591B2 JPH0562591B2 JP63128660A JP12866088A JPH0562591B2 JP H0562591 B2 JPH0562591 B2 JP H0562591B2 JP 63128660 A JP63128660 A JP 63128660A JP 12866088 A JP12866088 A JP 12866088A JP H0562591 B2 JPH0562591 B2 JP H0562591B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- group
- positive integer
- epoxy
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63128660A JPH01125224A (ja) | 1987-07-06 | 1988-05-26 | 電気絶縁用積層板及び電子部品封止材料 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-168220 | 1987-07-06 | ||
| JP16822087 | 1987-07-06 | ||
| JP63128660A JPH01125224A (ja) | 1987-07-06 | 1988-05-26 | 電気絶縁用積層板及び電子部品封止材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01125224A JPH01125224A (ja) | 1989-05-17 |
| JPH0562591B2 true JPH0562591B2 (https=) | 1993-09-08 |
Family
ID=15864014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63128660A Granted JPH01125224A (ja) | 1987-07-06 | 1988-05-26 | 電気絶縁用積層板及び電子部品封止材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01125224A (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036599A (https=) * | 1973-08-03 | 1975-04-05 | ||
| JPH068295B2 (ja) * | 1985-07-31 | 1994-02-02 | 住友化学工業株式会社 | 熱硬化可能なイミド化合物 |
-
1988
- 1988-05-26 JP JP63128660A patent/JPH01125224A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01125224A (ja) | 1989-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |