JPH0562467B2 - - Google Patents

Info

Publication number
JPH0562467B2
JPH0562467B2 JP58213073A JP21307383A JPH0562467B2 JP H0562467 B2 JPH0562467 B2 JP H0562467B2 JP 58213073 A JP58213073 A JP 58213073A JP 21307383 A JP21307383 A JP 21307383A JP H0562467 B2 JPH0562467 B2 JP H0562467B2
Authority
JP
Japan
Prior art keywords
base material
lead frame
manufacturing
plating
alloy layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP58213073A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60105259A (ja
Inventor
Kuniaki Seki
Shinichi Nishama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP21307383A priority Critical patent/JPS60105259A/ja
Publication of JPS60105259A publication Critical patent/JPS60105259A/ja
Publication of JPH0562467B2 publication Critical patent/JPH0562467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Physical Vapour Deposition (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21307383A 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材 Granted JPS60105259A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21307383A JPS60105259A (ja) 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21307383A JPS60105259A (ja) 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材

Publications (2)

Publication Number Publication Date
JPS60105259A JPS60105259A (ja) 1985-06-10
JPH0562467B2 true JPH0562467B2 (enrdf_load_stackoverflow) 1993-09-08

Family

ID=16633091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21307383A Granted JPS60105259A (ja) 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS60105259A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6480056A (en) * 1987-09-21 1989-03-24 Dainippon Printing Co Ltd Manufacture of conductive material for electronic component
JP2542735B2 (ja) * 1990-04-16 1996-10-09 三菱電機株式会社 半導体リ―ドフレ―ム材料及びその製造方法
JP2591729Y2 (ja) * 1991-06-20 1999-03-10 三菱電線工業株式会社 ワーク供給装置
US5343073A (en) * 1992-01-17 1994-08-30 Olin Corporation Lead frames having a chromium and zinc alloy coating
DE4239311C2 (de) * 1992-11-23 1996-04-18 Guehring Joerg Dr Bohrer, insbesondere Spitzbohrwerkzeug mit austauschbarem Schneideinsatz
WO1996015284A1 (en) * 1994-11-09 1996-05-23 Cametoid Advanced Technologies Inc. Method of producing reactive element modified-aluminide diffusion coatings
JP4644762B2 (ja) * 2005-11-01 2011-03-02 株式会社アドバンストシステムズジャパン スパイラル状接触子およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147261A (en) * 1981-03-06 1982-09-11 Hitachi Cable Ltd Partly reinforcing method for metal
JPS58153356A (ja) * 1982-03-05 1983-09-12 Mitsubishi Metal Corp 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Also Published As

Publication number Publication date
JPS60105259A (ja) 1985-06-10

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees