JPH0560257B2 - - Google Patents
Info
- Publication number
- JPH0560257B2 JPH0560257B2 JP18673284A JP18673284A JPH0560257B2 JP H0560257 B2 JPH0560257 B2 JP H0560257B2 JP 18673284 A JP18673284 A JP 18673284A JP 18673284 A JP18673284 A JP 18673284A JP H0560257 B2 JPH0560257 B2 JP H0560257B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- photoresist
- thin film
- inductor
- electrolytic plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- 239000010409 thin film Substances 0.000 claims description 26
- 229920002120 photoresistant polymer Polymers 0.000 claims description 25
- 238000009713 electroplating Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 239000012670 alkaline solution Substances 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010408 film Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18673284A JPS6164140A (ja) | 1984-09-06 | 1984-09-06 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18673284A JPS6164140A (ja) | 1984-09-06 | 1984-09-06 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6164140A JPS6164140A (ja) | 1986-04-02 |
| JPH0560257B2 true JPH0560257B2 (enrdf_load_stackoverflow) | 1993-09-01 |
Family
ID=16193670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18673284A Granted JPS6164140A (ja) | 1984-09-06 | 1984-09-06 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6164140A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065785A (ja) * | 1992-06-24 | 1994-01-14 | Nec Corp | スパイラルインダクタの製造方法 |
| JP5013131B2 (ja) * | 2009-02-13 | 2012-08-29 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
-
1984
- 1984-09-06 JP JP18673284A patent/JPS6164140A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6164140A (ja) | 1986-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5316974A (en) | Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer | |
| KR940010510B1 (ko) | 반도체 장치 제조 방법 | |
| US5171711A (en) | Method of manufacturing integrated circuit devices | |
| JP3413020B2 (ja) | 半導体装置の製造方法 | |
| US3386894A (en) | Formation of metallic contacts | |
| EP1093329A3 (en) | Wiring circuit substrate and manufacturing method therefor | |
| US3528090A (en) | Method of providing an electric connection on a surface of an electronic device and device obtained by using said method | |
| US4078980A (en) | Electrolytic chromium etching of chromium-layered semiconductor | |
| JP2002231871A (ja) | リードフレームの製造方法及びリードフレーム | |
| JPH06196846A (ja) | セラミック基板上に銅回路パターンを形成する方法 | |
| JPH0560257B2 (enrdf_load_stackoverflow) | ||
| US4082604A (en) | Semiconductor process | |
| CN110337710B (zh) | 用于铂图案化的牺牲层 | |
| US5403466A (en) | Silver plating process for lead frames | |
| US4873565A (en) | Method and apparatus for providing interconnection between metallization layers on semiconductor devices | |
| JPS5823928B2 (ja) | ハンドウタイソウチノセイゾウホウホウ | |
| JP3211287B2 (ja) | 半導体装置の製造方法 | |
| JPH10135604A (ja) | １０５乃至４００ミクロン膜厚並びに１７乃至１０５ミクロン膜厚のハイブリットプリント回路の製造方法 | |
| JP2005129665A (ja) | 半導体装置およびその製造方法 | |
| JPS6032357B2 (ja) | 容量素子の製造方法 | |
| JP3191686B2 (ja) | 印刷配線板の製造方法 | |
| JP2004063643A (ja) | プリント配線板の製造方法 | |
| JP2001127062A (ja) | 配線の形成方法 | |
| JPH07231061A (ja) | リードフレームの加工方法 | |
| JP2929850B2 (ja) | 半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |