JPH0558680B2 - - Google Patents
Info
- Publication number
- JPH0558680B2 JPH0558680B2 JP959587A JP959587A JPH0558680B2 JP H0558680 B2 JPH0558680 B2 JP H0558680B2 JP 959587 A JP959587 A JP 959587A JP 959587 A JP959587 A JP 959587A JP H0558680 B2 JPH0558680 B2 JP H0558680B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- leads
- circuit boards
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000010396 two-hybrid screening Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP959587A JPS63177587A (ja) | 1987-01-19 | 1987-01-19 | 混成集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP959587A JPS63177587A (ja) | 1987-01-19 | 1987-01-19 | 混成集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177587A JPS63177587A (ja) | 1988-07-21 |
| JPH0558680B2 true JPH0558680B2 (es) | 1993-08-27 |
Family
ID=11724680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP959587A Granted JPS63177587A (ja) | 1987-01-19 | 1987-01-19 | 混成集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177587A (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113508031B (zh) * | 2020-02-07 | 2023-06-27 | 法国圣戈班玻璃厂 | 具有复合玻璃板和功能元件的连接装置 |
-
1987
- 1987-01-19 JP JP959587A patent/JPS63177587A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63177587A (ja) | 1988-07-21 |
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