JPH0558668B2 - - Google Patents
Info
- Publication number
- JPH0558668B2 JPH0558668B2 JP62110695A JP11069587A JPH0558668B2 JP H0558668 B2 JPH0558668 B2 JP H0558668B2 JP 62110695 A JP62110695 A JP 62110695A JP 11069587 A JP11069587 A JP 11069587A JP H0558668 B2 JPH0558668 B2 JP H0558668B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- multilayer wiring
- layer
- multilayer
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62110695A JPS63276259A (ja) | 1987-05-08 | 1987-05-08 | 多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62110695A JPS63276259A (ja) | 1987-05-08 | 1987-05-08 | 多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63276259A JPS63276259A (ja) | 1988-11-14 |
| JPH0558668B2 true JPH0558668B2 (enrdf_load_stackoverflow) | 1993-08-27 |
Family
ID=14542108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62110695A Granted JPS63276259A (ja) | 1987-05-08 | 1987-05-08 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63276259A (enrdf_load_stackoverflow) |
-
1987
- 1987-05-08 JP JP62110695A patent/JPS63276259A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63276259A (ja) | 1988-11-14 |
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