JPH0556040B2 - - Google Patents

Info

Publication number
JPH0556040B2
JPH0556040B2 JP60263427A JP26342785A JPH0556040B2 JP H0556040 B2 JPH0556040 B2 JP H0556040B2 JP 60263427 A JP60263427 A JP 60263427A JP 26342785 A JP26342785 A JP 26342785A JP H0556040 B2 JPH0556040 B2 JP H0556040B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
heat
flat plate
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60263427A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62123798A (ja
Inventor
Tooru Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP26342785A priority Critical patent/JPS62123798A/ja
Publication of JPS62123798A publication Critical patent/JPS62123798A/ja
Publication of JPH0556040B2 publication Critical patent/JPH0556040B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP26342785A 1985-11-22 1985-11-22 複合型プリント基板 Granted JPS62123798A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26342785A JPS62123798A (ja) 1985-11-22 1985-11-22 複合型プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26342785A JPS62123798A (ja) 1985-11-22 1985-11-22 複合型プリント基板

Publications (2)

Publication Number Publication Date
JPS62123798A JPS62123798A (ja) 1987-06-05
JPH0556040B2 true JPH0556040B2 (enrdf_load_stackoverflow) 1993-08-18

Family

ID=17389344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26342785A Granted JPS62123798A (ja) 1985-11-22 1985-11-22 複合型プリント基板

Country Status (1)

Country Link
JP (1) JPS62123798A (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231311Y2 (enrdf_load_stackoverflow) * 1973-08-14 1977-07-16
JPS55147792U (enrdf_load_stackoverflow) * 1979-04-12 1980-10-23
JPS5877299A (ja) * 1981-11-02 1983-05-10 松下電器産業株式会社 電子部品実装用放熱基板

Also Published As

Publication number Publication date
JPS62123798A (ja) 1987-06-05

Similar Documents

Publication Publication Date Title
JP2001332670A (ja) 半導体装置の実装構造
JPH0736468U (ja) 電子部品の放熱構造
JPH0210800A (ja) 放熱体
JPH0556040B2 (enrdf_load_stackoverflow)
JPH05259669A (ja) 印刷配線基板の放熱構造
JP2022178791A (ja) 電子制御装置
JPH0927689A (ja) 電子部品ユニット
JPS6339976Y2 (enrdf_load_stackoverflow)
JP3325705B2 (ja) 電子機器の放熱装置
JPH09321467A (ja) 発熱電子部品の放熱構造
JP7502470B2 (ja) 電子制御装置
JPH10224065A (ja) 電子回路の放熱構造
JPH06112676A (ja) 放熱フィン取り付け構造
JPS58115892A (ja) 制御板盤
JPH0810203Y2 (ja) 放熱用クランプ装置
JPH0334916Y2 (enrdf_load_stackoverflow)
KR200357026Y1 (ko) 발열소자의방열구조
JPH1093271A (ja) パワーデバイスパッケージの放熱及び固定方法
JP2000183573A (ja) 半導体発熱素子の二重構造型放熱装置
JP2575953Y2 (ja) 半導体部品取付構造
JPH0534153Y2 (enrdf_load_stackoverflow)
JPH10189842A (ja) 発熱部品の放熱構造
JPH0316314Y2 (enrdf_load_stackoverflow)
JPH0445249Y2 (enrdf_load_stackoverflow)
JP2509277Y2 (ja) 放熱部品の取付構造