JPH0556040B2 - - Google Patents
Info
- Publication number
- JPH0556040B2 JPH0556040B2 JP60263427A JP26342785A JPH0556040B2 JP H0556040 B2 JPH0556040 B2 JP H0556040B2 JP 60263427 A JP60263427 A JP 60263427A JP 26342785 A JP26342785 A JP 26342785A JP H0556040 B2 JPH0556040 B2 JP H0556040B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat
- flat plate
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明は、プリント基板と熱伝導率の高い平板
とを密着させて放熱効果を良くする構造の複合型
プリント基板に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite printed circuit board having a structure in which a printed circuit board and a flat plate with high thermal conductivity are brought into close contact with each other to improve the heat dissipation effect.
従来、プリント基板と熱伝導率の高い平板とを
密着させた所謂複合型プリント基板に、放熱する
電子部分を実装した場合において、その電子部品
よりの熱を放熱させる場合には、例えば第１図に
示す如く、複合型プリント基板１にＬ型放熱器３
を取り付け、この放熱器３に発熱する電子部品２
を取り付けている。 Conventionally, when a heat dissipating electronic part is mounted on a so-called composite printed circuit board in which a printed circuit board and a flat plate with high thermal conductivity are brought into close contact with each other, when the heat from the electronic component is to be dissipated, for example, the method shown in Fig. 1 is used. As shown in FIG.
Attach the electronic component 2 that generates heat to this radiator 3.
is installed.
しかし、この構造では、放熱器３と複合型プリ
ント基板１との固定のためのねじ止め又は接着で
行なうため、作業工数が増え、更に放熱器３と複
合型プリント基板１との接触面での熱伝導が悪く
なり、発熱する電子部品２の放熱を有効に行なえ
ないという欠点を有する。 However, in this structure, the heatsink 3 and the composite printed circuit board 1 are fixed by screws or adhesives, which increases the number of work steps, and furthermore, the amount of work required at the contact surface between the heatsink 3 and the composite printed circuit board 1 is increased. This has the disadvantage that heat conduction deteriorates and heat from the electronic component 2 that generates heat cannot be effectively radiated.
本発明はかかる点に鑑み、複合型プリント基板
の熱伝導率の高い平板を加工し、熱抵抗を上げる
ことなく放熱器を使用せず、有効に発熱する部品
の熱を放熱させる構造の複合型プリント基板を提
案することを主たる目的とする。 In view of this, the present invention is a composite type printed circuit board with a structure that effectively radiates heat from heat-generating components without increasing thermal resistance and without using a heat sink by processing a flat plate with high thermal conductivity of a composite type printed circuit board. The main purpose is to propose printed circuit boards.
以下本発明の一実施例について図面を参照しな
がら詳細に説明する。 An embodiment of the present invention will be described in detail below with reference to the drawings.
第２図は本発明の一例を示す側面図である。４
は複合型プリント基板の熱伝導率の高い平板を示
し、これの一部分をコ字状に切り取つて折り曲
げ、その立ち上がり部６に、発熱する部品２を直
接取り付ける。そして第１図及び第２図に示す如
く、印刷配線面と反対面と平板４とを密着するよ
うに固定し、発熱部品２のリード線が所定の印刷
配線用孔に差し込まれ、よつて、発熱する部品２
の熱を熱伝導率の高い平板４に直接放熱をするよ
うにしている。更に、平板４の折り曲げにより熱
抵抗が高くなつている箇所に、熱伝導率の高い物
質５を充填することにより、この部分の熱抵抗が
増加することを防止している。 FIG. 2 is a side view showing an example of the present invention. 4
shows a flat plate with high thermal conductivity of a composite printed circuit board, a part of which is cut out into a U-shape and bent, and a heat-generating component 2 is directly attached to the rising part 6 of the plate. Then, as shown in FIGS. 1 and 2, the surface opposite to the printed wiring surface and the flat plate 4 are fixed in close contact with each other, and the lead wire of the heat generating component 2 is inserted into a predetermined printed wiring hole. Parts that generate heat 2
The heat is radiated directly to the flat plate 4 having high thermal conductivity. Furthermore, by filling the material 5 with high thermal conductivity into a portion where the thermal resistance is increased due to bending of the flat plate 4, an increase in the thermal resistance of this portion is prevented.
本発明の外観は第３図の如くである。尚、折り
曲げ部の熱抵抗を下げるための物質５は、液体で
も固体でも練り状のものでもよく、発熱する部品
２の放熱を良くするための機能を有するものであ
ればよい。また、折り曲げの角度は直角でも鋭角
でも鈍角でもよく、発熱する部品２を正常に取り
付けることができるものであればよいことは勿論
である。 The appearance of the present invention is as shown in FIG. The substance 5 for lowering the thermal resistance of the bent portion may be liquid, solid, or kneaded, as long as it has a function of improving heat dissipation from the heat-generating component 2. Further, the bending angle may be a right angle, an acute angle, or an obtuse angle, as long as the heat-generating component 2 can be attached normally.
以上述べたごとく本発明によれば、プリント基
板の印刷配線面の反対面と熱伝導性の高い平板と
を密着した複合型プリント基板において、平板の
実装スペース部の一部を切り抜いて印刷配線面と
反対方向へ折曲げ、折曲げ箇所に発熱部品が取り
付けられ、折曲げ部に生ずる高熱抵抗部に熱伝導
性の高い物質を充填したので、
上記折り曲げ箇所に取り付けられた発熱する電
子部品等は、別途の放熱器を使用せずに充分に放
熱することができ、しかも従来よりも部品点数を
減らし、取り付け工数を減らすことにより、コス
トの低減化を行ない、かつ放熱効果を向上できる
という効果を有する。 As described above, according to the present invention, in a composite printed circuit board in which the surface opposite to the printed wiring surface of the printed circuit board and a highly thermally conductive flat plate are in close contact with each other, a part of the mounting space of the flat plate is cut out, and the printed wiring surface is The heat-generating parts are attached to the bent part, and the high heat resistance part that occurs at the bent part is filled with a material with high thermal conductivity. , it is possible to sufficiently dissipate heat without using a separate heatsink, and by reducing the number of parts and installation man-hours compared to conventional products, it has the effect of reducing costs and improving the heat dissipation effect. have
第１図は従来の構造を示す側面図、第２図は本
発明の一実施例を示す断面図、第３図は同じく斜
視図である。
１……複合型プリント基板、２……発熱する部
品、４……熱伝導率の高い平板、５……熱伝導率
の高い物質、６……立ち上がり部。
FIG. 1 is a side view showing a conventional structure, FIG. 2 is a sectional view showing an embodiment of the present invention, and FIG. 3 is a perspective view. 1... Composite printed circuit board, 2... Parts that generate heat, 4... Flat plate with high thermal conductivity, 5... Material with high thermal conductivity, 6... Standing part.
Claims (1)
性の高い平板とを密着した複合型プリント基板に
おいて、 平板の実装スペース部を切り抜いて印刷配線面
と反対方向へ折曲げ、折曲げ面に発熱部品が取り
付けられ、折曲げ部に生ずる高熱抵抗部に熱伝導
性の高い物質を充填したことを特徴とする複合型
プリント基板。[Claims] 1. In a composite printed circuit board in which the surface opposite to the printed wiring surface of the printed circuit board and a highly thermally conductive flat plate are in close contact with each other, the mounting space portion of the flat plate is cut out and bent in the direction opposite to the printed wiring surface. A composite printed circuit board characterized in that a heat-generating component is attached to a bent surface, and a high heat resistance portion generated at the bent portion is filled with a highly thermally conductive substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26342785A JPS62123798A (en) | 1985-11-22 | 1985-11-22 | Complex printed wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26342785A JPS62123798A (en) | 1985-11-22 | 1985-11-22 | Complex printed wiring substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62123798A JPS62123798A (en) | 1987-06-05 |
| JPH0556040B2 true JPH0556040B2 (en) | 1993-08-18 |
Family
ID=17389344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26342785A Granted JPS62123798A (en) | 1985-11-22 | 1985-11-22 | Complex printed wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62123798A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040831U (en) * | 1973-08-14 | 1975-04-25 | ||
| JPS5877299A (en) * | 1981-11-02 | 1983-05-10 | 松下電器産業株式会社 | Heat sink substrate for mounting electronic part |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55147792U (en) * | 1979-04-12 | 1980-10-23 |
-
1985
- 1985-11-22 JP JP26342785A patent/JPS62123798A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040831U (en) * | 1973-08-14 | 1975-04-25 | ||
| JPS5877299A (en) * | 1981-11-02 | 1983-05-10 | 松下電器産業株式会社 | Heat sink substrate for mounting electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62123798A (en) | 1987-06-05 |
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