JPH055378B2 - - Google Patents

Info

Publication number
JPH055378B2
JPH055378B2 JP62293806A JP29380687A JPH055378B2 JP H055378 B2 JPH055378 B2 JP H055378B2 JP 62293806 A JP62293806 A JP 62293806A JP 29380687 A JP29380687 A JP 29380687A JP H055378 B2 JPH055378 B2 JP H055378B2
Authority
JP
Japan
Prior art keywords
copper
plating
lead frame
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62293806A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01135057A (ja
Inventor
Motohisa Myato
Riichi Tsuno
Ryoichi Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP29380687A priority Critical patent/JPH01135057A/ja
Publication of JPH01135057A publication Critical patent/JPH01135057A/ja
Publication of JPH055378B2 publication Critical patent/JPH055378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP29380687A 1987-11-20 1987-11-20 リードフレーム材料の製造方法 Granted JPH01135057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29380687A JPH01135057A (ja) 1987-11-20 1987-11-20 リードフレーム材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29380687A JPH01135057A (ja) 1987-11-20 1987-11-20 リードフレーム材料の製造方法

Publications (2)

Publication Number Publication Date
JPH01135057A JPH01135057A (ja) 1989-05-26
JPH055378B2 true JPH055378B2 (enrdf_load_stackoverflow) 1993-01-22

Family

ID=17799394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29380687A Granted JPH01135057A (ja) 1987-11-20 1987-11-20 リードフレーム材料の製造方法

Country Status (1)

Country Link
JP (1) JPH01135057A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497032B2 (ja) * 2005-06-16 2010-07-07 Ｔｄｋ株式会社 電子部品
JP6262968B2 (ja) * 2013-09-09 2018-01-17 Ｄｏｗａメタルテック株式会社 電子部品搭載基板およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5137891B2 (enrdf_load_stackoverflow) * 1973-06-15 1976-10-19
JPS5679810A (en) * 1979-12-03 1981-06-30 Sumitomo Electric Industries Method of manufacturing lead wire for electronic part
JPH061798B2 (ja) * 1985-07-17 1994-01-05 株式会社神戸製鋼所 リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH01135057A (ja) 1989-05-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees