JPH01135057A - リードフレーム材料の製造方法 - Google Patents
リードフレーム材料の製造方法Info
- Publication number
- JPH01135057A JPH01135057A JP29380687A JP29380687A JPH01135057A JP H01135057 A JPH01135057 A JP H01135057A JP 29380687 A JP29380687 A JP 29380687A JP 29380687 A JP29380687 A JP 29380687A JP H01135057 A JPH01135057 A JP H01135057A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- copper
- copper layer
- frame material
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000010949 copper Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 230000003746 surface roughness Effects 0.000 claims abstract description 12
- 238000000137 annealing Methods 0.000 claims abstract description 6
- 238000005097 cold rolling Methods 0.000 claims abstract description 6
- 239000007769 metal material Substances 0.000 claims abstract 3
- 238000005096 rolling process Methods 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 22
- 239000010410 layer Substances 0.000 description 13
- 239000010931 gold Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 229910000881 Cu alloy Inorganic materials 0.000 description 9
- 229910052718 tin Inorganic materials 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 229910001096 P alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910005487 Ni2Si Inorganic materials 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29380687A JPH01135057A (ja) | 1987-11-20 | 1987-11-20 | リードフレーム材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29380687A JPH01135057A (ja) | 1987-11-20 | 1987-11-20 | リードフレーム材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01135057A true JPH01135057A (ja) | 1989-05-26 |
| JPH055378B2 JPH055378B2 (enrdf_load_stackoverflow) | 1993-01-22 |
Family
ID=17799394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29380687A Granted JPH01135057A (ja) | 1987-11-20 | 1987-11-20 | リードフレーム材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135057A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351852A (ja) * | 2005-06-16 | 2006-12-28 | Tdk Corp | 電子部品 |
| KR20160054549A (ko) * | 2013-09-09 | 2016-05-16 | 도와 메탈테크 가부시키가이샤 | 전자 부품 탑재 기판 및 그 제조 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015744A (enrdf_load_stackoverflow) * | 1973-06-15 | 1975-02-19 | ||
| JPS5679810A (en) * | 1979-12-03 | 1981-06-30 | Sumitomo Electric Industries | Method of manufacturing lead wire for electronic part |
| JPS6218744A (ja) * | 1985-07-17 | 1987-01-27 | Kobe Steel Ltd | リ−ドフレ−ム |
-
1987
- 1987-11-20 JP JP29380687A patent/JPH01135057A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015744A (enrdf_load_stackoverflow) * | 1973-06-15 | 1975-02-19 | ||
| JPS5679810A (en) * | 1979-12-03 | 1981-06-30 | Sumitomo Electric Industries | Method of manufacturing lead wire for electronic part |
| JPS6218744A (ja) * | 1985-07-17 | 1987-01-27 | Kobe Steel Ltd | リ−ドフレ−ム |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351852A (ja) * | 2005-06-16 | 2006-12-28 | Tdk Corp | 電子部品 |
| KR20160054549A (ko) * | 2013-09-09 | 2016-05-16 | 도와 메탈테크 가부시키가이샤 | 전자 부품 탑재 기판 및 그 제조 방법 |
| EP3048640A4 (en) * | 2013-09-09 | 2017-07-19 | Dowa Metaltech Co., Ltd | Electronic-component-equipped substrate and method for producing same |
| US9831157B2 (en) * | 2013-09-09 | 2017-11-28 | Dowa Metaltech Co., Ltd. | Method of attaching an electronic part to a copper plate having a surface roughness |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055378B2 (enrdf_load_stackoverflow) | 1993-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |